Industry News: solder bridging at qfn (Page 1 of 16)

SMTA China Presents Awards at SMTA China East 2010 Conference/Nepcon China 2010

Industry News | 2010-04-30 18:47:15.0

SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.

Surface Mount Technology Association (SMTA)

SMTA China Presents Best Paper/Presentation Awards & Best Exhibit Awards at SMTA China

Industry News | 2014-09-18 17:55:32.0

SMTA China announcing that it presented awards for nine papers at the SMTA China South 2014 Conference Award Presentation Ceremony, held on Tuesday, August 26, 2014 at Shenzhen Convention & Exhibition Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

SMTA China Presents Seven Best Paper/Best Presentation Awards and Two Best Exhibit Awards at SMTA China East Conference 2017/NEPCON China 2017

Industry News | 2017-05-15 16:35:00.0

SMTA China announces that it presented awards for seven papers and two exhibits at the SMTA China East Conference 2017 Award Presentation Ceremony, held on Tuesday, April 25, 2017 at the Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

SMT Book – Surface Mount Technology Book PDF

Industry News | 2018-12-08 03:17:14.0

SMT Book – Surface Mount Technology Book PDF

Flason Electronic Co.,limited

SMT Book – Surface Mount Technology Book PDF

Industry News | 2018-12-08 03:15:55.0

SMT Book – Surface Mount Technology Book PDF

Flason Electronic Co.,limited

New SN100CV solder paste from Nihon Superior at SMTAI reduces voiding

Industry News | 2018-09-18 20:11:02.0

Nihon Superior Co.today announced plans to exhibit in Booth #511 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will showcase the new SN100CVTM P608 D4 solder paste, NS-F851 rosin-based flux, ALUSAC-35 alloy and Alconano Nano-Silver paste.

Nihon Superior Co., Ltd.

Indium Corporation Senior Technologist's Knowledge Showcased at SMTA PanPac

Industry News | 2022-01-10 16:39:30.0

Indium Corporation's Ron Lasky, Ph.D., PE, senior technologist, will share his industry knowledge and expertise during two presentations at the SMTA Pan Pacific Microelectronics Symposium (SMTA PanPac), Jan. 31-Feb. 3, Honolulu, O'ahu, Hawaii, U.S.

Indium Corporation

MARTIN to Demonstrate Standalone BGA Reball and QFN Solder Bumping Unit at SMTA Upper Midwest

Industry News | 2010-05-29 18:57:32.0

MARTIN will demonstrate the Reball/Prebump 03.1 unit at the upcoming SMTA Upper Midwest Expo, scheduled to take place Wednesday, June 9, 2010, at the Sheraton Bloomington Hotel in Bloomington, MN. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.

Finetech

MARTIN to Demonstrate Standalone BGA Reball and QFN Solder Bumping Unit at SMTA Ohio Valley Expo & Tech Forum

Industry News | 2010-06-30 12:09:49.0

MARTIN will demonstrate the Reball / Prebump 03.1 unit at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled for Wednesday, July 14, 2010 at the Doubletree Hotel in Cleveland, OH. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.

Finetech

FINETECH to Present at SMT/HYBRID/PACKAGING

Industry News | 2009-04-23 20:46:52.0

FINETECH Product Manager Dominik Horn will give a presentation titled �QFN Rework in OEM Quality� at the upcoming SMT/HYBRID/PACKAGING Exhibition & Conference, scheduled to take place Wednesday, May 6, 2009 from 1:40-2 p.m.

Finetech

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