Industry News | 2012-04-06 19:44:17.0
In SMT electronic assembly production, 3-D SPI has established itself as the additional inspection gate to complement optical or X-ray inspection.
Industry News | 2007-11-01 20:29:37.0
November 1, 2007 - Lloyd Doyle announces they will showcase the IBIS system, a brand new development for solder bump inspection, in Hall A1 Stand 347 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.
Industry News | 2016-02-25 14:29:00.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2016-05-31 20:58:06.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2020-03-08 16:35:13.0
SEHO North America, Inc. will exhibit at the SMTA Intermountain Expo & Tech Forum, scheduled to take place March 10, 2020 at the Boise State University in Idaho. The company will discuss the latest innovations for cost-efficient high-mix wave soldering.
Industry News | 2020-01-07 11:28:02.0
SEHO North America, Inc. will highlight innovative solutions for cost-efficient high-mix production in Booth #1451 at the IPC APEX EXPO, scheduled to take place Feb. 4 - 6, 2020 at the San Diego Convention Center.
Industry News | 2020-09-06 04:37:56.0
CyberOptics® Corporation (NASDAQ: CYBE) will present at the SEMICON Taiwan Global SiP Summit on September 24, 2020 at 4:20pm. Tim Skunes, VP of R&D at CyberOptics, will share the technical presentation 'Fast, 100% 3D Wafer Bump Metrology and Inspection to Improve Yields and 3D System Integration'.
Industry News | 2024-09-23 20:27:15.0
PEMTRON is pleased to announce plans to exhibit at the TPCA Show, scheduled to take place Oct. 23-25, 2024 in Taipei, where it will showcase its latest innovations in inspection equipment. Visitors to Booth will have the opportunity to explore four state-of-the-art systems: POSEIDON, 8800AI, 8800FI and JUPITER, each designed to enhance precision, efficiency and quality control.
Industry News | 2019-10-16 14:38:04.0
SEHO Systems GmbH will exhibit in Hall A4, Booth #578 at the upcoming productronica, scheduled to take place Nov.12-15, 2019 in Munich, Germany. The company will showcase innovative features for its product range. The new functions are designed to bring process reliability to a higher level and further improve production sequences in electronic manufacturing.
Industry News | 2020-11-18 15:38:26.0
CyberOptics® Corporation (NASDAQ: CYBE) will present at the Virtual IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) on December 16th at 8:00amCT.
