Industry News | 2007-11-01 20:29:37.0
November 1, 2007 - Lloyd Doyle announces they will showcase the IBIS system, a brand new development for solder bump inspection, in Hall A1 Stand 347 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Industry News | 2021-11-17 15:21:10.0
CyberOptics® Corporation (NASDAQ: CYBE) received a 2021 GLOBAL Technology Award in the category of Metrology for its WX3000™ Metrology and Inspection System. The award was announced during a ceremony that took place Tuesday, Nov. 16, 2021 at Productronica in Munich, Germany.
Industry News | 2020-07-09 18:33:25.0
WX3000 Systems Incorporate Proprietary NanoResolution MRS™ Sensor Technology
Industry News | 2007-09-14 09:28:37.0
Chalman Technologies is new CT USA Representative
Industry News | 2007-09-27 12:21:24.0
Techsystems International is now Cyber Technologies' Contact in the Region
Industry News | 2007-10-11 14:26:03.0
i-TECH.com is the new Cyber Technologies Representative
Industry News | 2020-03-08 16:35:13.0
SEHO North America, Inc. will exhibit at the SMTA Intermountain Expo & Tech Forum, scheduled to take place March 10, 2020 at the Boise State University in Idaho. The company will discuss the latest innovations for cost-efficient high-mix wave soldering.
Industry News | 2020-01-07 11:28:02.0
SEHO North America, Inc. will highlight innovative solutions for cost-efficient high-mix production in Booth #1451 at the IPC APEX EXPO, scheduled to take place Feb. 4 - 6, 2020 at the San Diego Convention Center.
Industry News | 2021-10-11 08:08:21.0
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, announces the release of its new Meister D+ semiconductor inspection solution. Premium True3D™ Inspection Solution for Chiplets and System-in-Package (SiP) devices including die and surface mount components. The new Meister D+ is an extension of the Meister product family that features solutions ranging from solder paste, printed bumps, and solder ball to small components like 0201Ms and highly reflective die.
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