Industry News: solder density (Page 7 of 39)

IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

Industry News | 2010-07-22 22:37:02.0

IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.

Association Connecting Electronics Industries (IPC)

PCBA Cleaning Machine

Industry News | 2022-10-12 11:23:36.0

In the SMT industry, there are many types of cleaning machines. According to the cleaning things, there are stencil cleaner, PCBA cleaner, Wave Oven Pallet/Fixture cleaner, Mis-Print PCB cleaner, Squeegee cleaner, Nozzle cleaner, PCB surface cleaner and so on.

Dongguan Intercontinental Technology Co., Ltd.

Updates to IPC-6012 and IPC-A-600 Released: Five Years of New Board Technologies and Processes Bring Significant Changes to Specifications.

Industry News | 2010-04-10 02:09:54.0

If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.

Association Connecting Electronics Industries (IPC)

Unique software for dispensing two-component fluids wins Global Technology Award for ASYMTEK Automated Ratio Calibration (ARC™) Technology

Industry News | 2020-10-12 15:09:12.0

Enables easier set-up and ensures accurate mix ratios by volume or weight to improve overall dispense quality ASYMTEK, a part of Nordson ELECTRONICS SOLUTIONS - a global leader in electronics manufacturing technologies, announces its latest technology has received the Global Technology Award 2020 for fluid dispensing equipment. Nordson Electronics Solutions developed the patent-pending software, Automated Ratio Calibration Technology (ARC™ Technology), to enable easier set-up and sustained mix ratios for dispensing two-component (2K) fluid materials. ARC Technology is part of a system, which includes ASYMTEK Vortik® progressive cavity pumps and ASYMTEK dispensing platforms, that ensures consistently accurate mix ratios by volume or weight to improve overall dispense quality. The award was announced by Global SMT & Packaging magazine during a virtual ceremony held on September 29, 2020.

ASYMTEK Products | Nordson Electronics Solutions

Metcal customers go for gold with proven solder Technologies

Industry News | 2008-12-02 16:49:28.0

OK International has long been driving productivity for its customers, as a young engineer recently found out when the Metcal MX-500S Soldering and Rework System helped him to gold medal position at the World Skills Competition. OK International has now extended the proven capabilities of this product even further with the launch of the highly anticipated MX-5000 Soldering, Desoldering and Rework System.

OK International

SHENMAO Offers Halogen-Free SM-862 Liquid Flux

Industry News | 2022-02-25 13:23:30.0

SHENMAO America, Inc. is pleased to offer its halogen-free SM-862 Liquid Flux that can replace the widely sold halogenated SM-816. The flux features low solid content and smooth flux residue, making it suitable for automatic wave soldering and manual dipping processes.

Shenmao Technology Inc.

The Balver Zinn Group to Supply BRILLIANT B2012 Solder Wire for the SMT IPC Hand Soldering Competition

Industry News | 2016-04-19 05:13:13.0

The Balver Zinn group announced that they will sponsoring the IPC Hand Soldering Competition at SMT Hybrid Packaging in Nuremberg-Germany, scheduled to take place April 26-28, 2016. Balver Zinn will be contributing BRILLIANT B2012 solder wire which is halide-free, rosin based and designed for manual and robotic soldering.

Balver Zinn

The Balver Zinn Group to Supply BRILLIANT B2012 Solder Wire for the SMT IPC Hand Soldering Competition

Industry News | 2017-05-09 04:41:07.0

The Balver Zinn group announces that they will sponsoring the IPC Hand Soldering Competition at SMT Hybrid Packaging in Nuremberg-Germany, scheduled to take place May 16-18, 2017. Balver Zinn will be contributing BRILLIANT B2012 solder wire which is halide-free, rosin based and designed for manual and robotic soldering.

Balver Zinn

The Balver Zinn Group Proud Sponsor of the Productronica IPC Hand Soldering Competition

Industry News | 2017-11-03 09:46:42.0

The Balver Zinn Group announced that they will be sponsoring the IPC Hand Soldering Competition (IPC-HSC) scheduled to take place November 14-16, 2017 at Productronica - New Munich Trade Fair Centre in Munich, Germany. Balver Zinn will be providing BRILLIANT B2012 SAC305 (SN97C) solder wire which is halide-free, rosin based and designed for manual and robotic soldering.

Balver Zinn

SHENMAO Offers Halogen-Free SM-862 Liquid Flux as a Replacement for SM-816

Industry News | 2023-07-19 09:24:50.0

SHENMAO America, Inc. is pleased to announce the availability of its halogen-free SM-862 Liquid Flux, designed to replace the widely used halogenated SM-816. The SM-862 Flux offers a range of benefits, including low solid content and smooth residue, making it an excellent choice for automatic wave soldering and manual dipping processes.

Shenmao Technology Inc.


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