Industry News: solder density (Page 8 of 39)

Indium Corporation VP of Technology to Present SMTA Webtorial

Industry News | 2015-01-20 23:40:52.0

Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present two SMTA webtorials on Feb. 10 and 17. Dr. Lee's presentation, Electromigration-The Hurdle for Miniaturization and High Power Devices, discusses critical aspects regarding the electromigration of solder joints, including failure mechanisms, the effect of solder alloy composition, solder joint metallurgy and configuration, pad design and composition, current density, temperature, and current polarity.

Indium Corporation

Indium Corporation Expands Fine Wire Capabilities

Industry News | 2022-01-29 13:28:14.0

Indium Corporation has expanded its manufacturing capabilities to include a fine diameter 0.004" (0.10mm) flux-cored wire made with select Pb-free alloys to help customers meet the progressively demanding requirements of fine-pitch applications.

Indium Corporation

JUKI Debuts RP-1, Industry’s First Solder Paste Printer with Unique “Motion Screen” Mechanism

Industry News | 2014-01-27 15:41:51.0

JUKI introduces its new solder paste printer RP-1 with improved accuracy and productivity of PWB solder printing, excellent for high-density packaging of downsizing electronic devices.

Juki Automation Systems

Kyzen’s Informative Presentation at NEPCON South China Earns Best Paper Award

Industry News | 2013-08-30 09:54:58.0

Kyzen announces that it received a Best Paper award for its recent presentation during NEPCON South China, which was held from August 27-29, 2013.

KYZEN Corporation

Nihon Superior’s SN100C P600 D4 Paste Wins a 2009 Global Technology Award

Industry News | 2009-11-11 12:21:33.0

OSAKA, JAPAN — November 2009 — Nihon Superior Co. Ltd. announces that it has been awarded a 2009 Global Technology Award in the category of Soldering Materials for its SN100C P600 D4 Solder Paste. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.

Nihon Superior Co., Ltd.

Meet Kyzen’s Experts at the SMTA Penang Vendor Show

Industry News | 2010-10-14 15:42:06.0

Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Chris Harvey, Asia Pacific Technical Manager, will present “Lead-Free No-Clean Soldering Materials Increase the Cleaning Challenge” at the upcoming SMTA Penang Vendor Show.

KYZEN Corporation

EasySpheres Features Kester’s 959T No-Clean Halide-Free Flux Pen®

Industry News | 2009-07-16 14:35:03.0

POWAY, CA — July 2009 — EasySpheres LLC features Kester’s 959T no-clean, non-corrosive, halide-free Flux Pen®.

EasySpheres LLC

MANNCORP DESIGNS LEAD-FREE, SMALL FOOTPRINT, BUDGET-PRICED WAVE SOLDER SYSTEM

Industry News | 2008-02-20 22:54:41.0

Designed and built to Manncorp�s own specifications, the MT-300 brings a budget-priced lead-free wave soldering solution to low to mid-volume PCB assemblers

Manncorp

ADVANCED FLEXIBLE SYSTEM FOR HOT-BAR SOLDERING OF LUMILED EMITTER TERMINALS

Industry News | 2004-10-05 10:01:41.0

Sophisticated solution for automatic utilization of LED�s

IVAS Tech Ltd.

SHENMAO Provides Quality Solder Paste for SMT Assembly

Industry News | 2019-04-01 19:56:55.0

SHENMAO America, Inc. provides a variety of solder paste products for SMT assembly including Tin Lead Solder Paste, Lead-Free Solder Paste, Water-Soluble Solder Paste, Package-on-Package Solder Paste, Low-Temperature Solder Paste, and Halogen-Free Solder Paste.

Shenmao Technology Inc.


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