Industry News | 2018-10-18 08:01:00.0
SMT solder joint quality and appearance inspection process
Industry News | 2017-10-12 15:05:21.0
KIC is pleased to announce the release of its new Vantage network software system. The new software provides a real-time dash-board for thermal processes, accessible anywhere, from any authorized PC or mobile device. The process data is automatically stored in a central location where the engineer can quickly retrieve and share all relevant data.
Industry News | 2018-10-18 08:04:17.0
Influences of the solder material for the wave soldering machine soldering quality
Industry News | 2016-01-25 10:44:17.0
Seika Machinery is pleased to introduce the MALCOM DS-10 Dip Tester. The tester provides data transmission to a PC by USB cable, creating a profile function. The dedicated software implements a high level of process management.
Industry News | 2017-06-25 20:33:39.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2018-02-10 06:10:03.0
Clearwater, FL - Solderstar, will be showcasing its full range of smart thermal profiling solutions at the IPC Apex Expo, held in San Diego between February 27th – March 1st 2018. The Solderstar systems feature the innovative ‘Smartlink’ connection system that allows one datalogger to be used with a range of intelligent fixtures
Industry News | 2014-05-16 14:31:53.0
While dip soldering of through-hole components has long been an easy and affordable way to automate manual soldering processes when the costs of wave soldering cannot be justified, these latest enhancements increase quality and repeatability to a degree that make Auto-Dip systems ideal for virtually any short-run, batch application.
Industry News | 2015-05-13 14:00:03.0
The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.
Industry News | 2023-09-11 16:51:02.0
Seika Machinery, Inc. is excited to announce its participation at SMTA International. The event will be held at the Minneapolis Convention Center in Minnesota from Oct. 10-11, 2023. Seika Machinery will present an impressive array of state-of-the-art solutions that cater to diverse manufacturing needs in booth 1500.
Industry News | 2021-06-30 04:24:18.0
Microtronic GmbH is pleased to introduce the new Automated & PC-Controlled D&L Automator for Dip and Look. Designed and manufactured in Germany, the new system meets IPC-J-STD-002 and 003 Standards.
