Industry News | 2012-11-02 09:04:14.0
IPC and SMTA jointly announce the agenda for Session 5 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Industry News | 2013-10-02 23:40:56.0
Ascentech LLC will exhibit the Gensonic UltraSonic Stencil Cleaner and the new Solder Saver at the upcoming SMTA International 2013. The Gensonic is a manually-operated, ultrasonic transducer unit for cleaning stencils used in printing solder pastes and adhesives. It can be used either directly on the printer or at a separate cleaning station.
Industry News | 2013-08-28 13:54:14.0
Ascentech LLC will exhibit the Gensonic UltraSonic Stencil Cleaner and the new Solder Saver at the upcoming SMTA Capital Expo & Technical Forum, which will be held September 10th, 2013 at the Johns Hopkins University/Applied Physics Lab, 1110 Johns Hopkins Rd., Laurel, MD 20723. Show Hours are from 9am-3:30pm.
Industry News | 2015-04-28 18:03:55.0
KYZEN is pleased to announce that it will present at the Toronto SMTA Expo & Tech Forum, scheduled to take place Thursday, May 21, 2015 at the Hilton Toronto/Markham Suites Conference Centre in Markham, ON. Dr. Mike Bixenman will present the paper titled “How Clean is Clean Enough?”
Industry News | 2009-09-17 14:28:17.0
NASHVILLE — September 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Mike Bixenman, CTO, along with co-author Mike Konrad, President of Aqueous Technologies, will hold a presentation titled “Cleaning for Reliability Post QFN Rework” at the upcoming SMTA International conference, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Industry News | 2010-08-27 15:08:50.0
Highly concentrated heat sources found in ever shrinking electronic designs have increased the demand for better heat dissipation. SMT has introduced several machines that accommodate larger, odd shaped substrates. The machines offer the same speed, precision, and repeatability found on SMT’s solder paste printers. This allows heat sink manufacturers to benefit from using proven, cost effective screen print technology
Industry News | 2019-11-05 22:08:21.0
Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.
Industry News | 2012-03-24 10:06:28.0
NEPCON China Becomes a Platform for the Debut of New Product Releases in Asia
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