Industry News | 2013-10-25 16:15:31.0
Barry Industries introduces a new 0904 size chip attenuator for Ku, K and Ka bands. The AV0904GA attenuator has been characterized to 30GHz, features gold wirebondable I/O terminals with epoxy mount ground pads and is rated to 750mW.
Industry News | 2016-08-28 13:28:32.0
Saki Corporation will demonstrate its 2D and 3D automated optical inspection (AOI) systems at NEPCON South China in booth 1G35. Saki's AOI systems' unique Phase Measurement Profilometry technology and quad-directional side cameras inspect and measure QFNs, J-leads, and connectors, and enable the detection of the most difficult defects, such as lifted leads, tombstones, reverses, and height variations, without a reduction in speed. NEPCON South China is being held August 30-September 1, 2016 at the Shenzhen Convention & Exhibition Center, Shenzhen, China.
Industry News | 2011-07-14 13:20:33.0
SinkPAD Corporation will be exhibiting at the LED show in Las Vegas introducing their new Cool down Aluminum PCB applications. The LED show and conference is on July 26th and 27th, the conference is both days while the expo is on the 27th.
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2011-05-12 22:13:47.0
Nordson DAGE showcased its newly developed 4000Plus pad cratering inspection system at Nepcon Shanghai.
Industry News | 2018-01-24 17:10:37.0
Viscom today announced plans to exhibit at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Calif. Constantly at the forefront of innovation for AOI, AXI and SPI, the company will show its X8011-II and X7056-II 3D X-ray inspection systems, along with the S3088 ultra gold, S3088 ultra chrome and S3088 SPI in Booth #1508.
Industry News | 2011-07-18 12:16:56.0
SinkPAD Corporation’s customer Wild Ideas Light Company today expressed their appreciation for SinkPAD’s PCB cooling technology.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2001-02-26 11:18:45.0
Innovative Flextac Stencils simplify BGA rework. These self-sticking laser cut, polymer solder paste stencils use a residue-free adhesive similar to Post-it Notes to seal around BGA pads to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.
