Industry News | 2014-01-13 10:59:04.0
Metcal today announced that it will exhibit in Booth #3340 at MD&M West, scheduled to take place February 11-13, 2014 at the Anaheim Convention Center in Anaheim, CA.
Industry News | 2009-09-17 14:28:17.0
NASHVILLE — September 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Mike Bixenman, CTO, along with co-author Mike Konrad, President of Aqueous Technologies, will hold a presentation titled “Cleaning for Reliability Post QFN Rework” at the upcoming SMTA International conference, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Industry News | 2010-09-27 23:15:26.0
VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2015-04-21 17:10:49.0
Saki Corporation will demonstrate its BF-3Di automated optical inspection and BF-3Si automated solder paste inspection systems at SMT Hybrid Packaging, Nuremberg, Germany, May 5-7 2015, in Stand 7-331.
Industry News | 2018-05-16 19:52:52.0
Thermaltronics has introduced a multifunction soldering tip tester that has the following measurement functions: Tip temperature (centigrade to Fahrenheit switchable), Tip to ground resistance (ohm), Tip to ground voltage leakage (mv)
Industry News | 2016-03-01 13:33:18.0
SAKI America will demonstrate its 3rd generation 3D automated optical inspection system at IPC APEX 2016, booth 1860. Saki's new 3D AOI, BF-3Di-Z1, accommodates XXL board sizes, offers dual-lane configurations, optional side angle cameras, and increases throughput by 15%. The 3D AOI system provides measurement of components with a height range from 0-20mm, achieving 1-micron height resolution, a false call rate of
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Industry News | 2012-04-09 13:45:59.0
As the electronics assembly industry evolves, printed circuit board (PCB) features and surface mount technology (SMT) components continue to get smaller and smaller. This miniaturization shrinks the process window at print, placement, and reflow, increasing the opportunities for defects.
Industry News | 2010-04-10 23:59:50.0
LOS ALAMITOS, CA - Following the success of their 2007 test board and kit, Practical Components and Aim Solder have updated their offering with a new AIM print test board and kit that is designed to include many printing challenges commonly found in manufacturers' assemblies.
Industry News | 2013-12-05 07:59:46.0
Ucamco is delighted to present its ground-breaking second extension for the Gerber format. This offers an unequivocal standard for non-image data that is just as simple, practical and universally accessible as the well-known Gerber image data format it now supports.
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