Industry News | 2013-01-17 16:15:15.0
PARMI will exhibit in booth #1527 at the IPC APEX EXPO.
Industry News | 2013-02-25 16:05:16.0
PARMI announces that it has been awarded a 2013 NPI Award in the category of Test & Inspection – SPI for its SPI HS70 Series.
Industry News | 2011-07-13 15:26:19.0
The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit its lead-free SN100C-XF3+ solder paste and wire at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled to take place Thursday, July 14, 2011 at the Doubletree Hotel in Cleveland, OH.
Industry News | 2011-08-22 20:06:30.0
Cobar Solder Products will exhibit its lead-free SN100C-XF3+ solder paste and wire in Booth #407 at the upcoming IPC Midwest Conference & Exhibition
Industry News | 2022-04-28 14:58:03.0
Magnalytix, the forefront driver in providing real-time reliability solutions for electronics manufacturing, is thrilled to announce that Co-Inventor Dr. Mike Bixenman will present "Electrochemical Reliability of 2-D and 3-D Models as a Function of the Electrical Field Effects" on Tuesday, May 17, 2022, at the Park Plaza Victoria in Amsterdam from 3:30-4 p.m.
Industry News | 2013-01-22 11:24:27.0
OK International will highlight the new Metcal MX-5200 Soldering, Desoldering and Rework Series on stand #G58
Industry News | 2022-05-18 13:07:51.0
SHENMAO America, Inc. offers PF735-P267J Low Melting Point Lead-Free Jetting Solder Paste specially designed for the jetting process. It offers excellent workability and solderability for automatic high-speed jetting production with superior accuracy and precision.
Industry News | 2012-01-26 22:58:30.0
Seika Machinery will introduce new features for the Seitec Bravo STS-2533 IN H & SJ Soldering System in Booth #2401 at the upcoming IPC APEX Expo.
Industry News | 2012-06-01 09:27:11.0
The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit its lead-free SN100C-XF3+ solder paste and wire at the upcoming SMTA Upper Midwest Expo & Tech Forum,
Industry News | 2016-09-22 18:12:16.0
Saki Corporation will demonstrate its BF-3Di-Z1 3D AOI system for extra-large (686x870mm) PCBs and easy-to-program real-time software in booth 726 at SMTA International, September 27 and 28th, 2016, being held at the Donald Stephens Convention Center, Rosemont, IL. Saki's 3D AOI systems measure heights from 0-20mm with 1µm resolution, measure the surface of surface mount devices and through-hole packages from all four directions without a dead angle or shadowing, and achieve full automation with very low false calls and zero escapes.
