Industry News: solder ground pad (Page 7 of 63)

Share Your Research at SMTA International 2016!

Industry News | 2015-11-25 16:58:05.0

On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.

Surface Mount Technology Association (SMTA)

OK International Launches New Corporate Web Site

Industry News | 2012-12-15 08:00:59.0

OK International today announced the launch of its new corporate Web site located at www.okinternational.com.

Association Connecting Electronics Industries (IPC)

Under what conditions do you set different temperatures for the TOP and Bottom heating elements of a reflow oven?

Industry News | 2018-10-18 10:12:06.0

Under what conditions do you set different temperatures for the TOP and Bottom heating elements of a reflow oven?

Flason Electronic Co.,limited

SMTA China Presents Best Paper/Presentation Awards & Best Exhibit Awards at SMTA China

Industry News | 2014-09-18 17:55:32.0

SMTA China announcing that it presented awards for nine papers at the SMTA China South 2014 Conference Award Presentation Ceremony, held on Tuesday, August 26, 2014 at Shenzhen Convention & Exhibition Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

Industry News | 2010-07-22 22:37:02.0

IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.

Association Connecting Electronics Industries (IPC)

Gold Fingers: A Guide to Understanding Gold-Plated PCB Connectors

Industry News | 2018-10-18 09:06:41.0

Gold Fingers: A Guide to Understanding Gold-Plated PCB Connectors

Flason Electronic Co.,limited

Plated Half Holes PCB

Industry News | 2018-10-18 10:46:44.0

Plated Half Holes PCB

Flason Electronic Co.,limited

IPC PERM COUNCIL WHITE PAPER EXAMINES LEAD-FREE RESEARCH PRIORITIES

Industry News | 2014-05-05 16:03:12.0

IPC’s Pb-Free Electronics Risk Management (PERM) Council has released a white paper, “PERM Council Pb-free Research Priorities” that identifies priority research areas regarding the impact and risks associated with the implementation of lead-free materials in electronics.

Association Connecting Electronics Industries (IPC)

How to Decrease PCB Fabrication and Assembly Costs While Maintaining High Quality

Industry News | 2018-10-18 10:04:27.0

How to Decrease PCB Fabrication and Assembly Costs While Maintaining High Quality

Flason Electronic Co.,limited

SMTA South East Asia Technical Conference on Electronics Assembly Technologies Call for Presentations Announced

Industry News | 2009-04-23 20:54:01.0

MINNEAPOLIS, MN � The SMTA is pleased to announce its latest technical event in Penang, Malaysia. The SMTA South East Asia Technical Conference on Electronics Assembly Technologies will be held November 19-20, 2009 at the Equatorial Hotel in Penang, Malaysia. Presentations are currently being solicited for the following key technology tracks:

Surface Mount Technology Association (SMTA)


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