Industry News | 2021-03-02 14:45:26.0
SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
Industry News | 2015-01-20 23:40:52.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present two SMTA webtorials on Feb. 10 and 17. Dr. Lee's presentation, Electromigration-The Hurdle for Miniaturization and High Power Devices, discusses critical aspects regarding the electromigration of solder joints, including failure mechanisms, the effect of solder alloy composition, solder joint metallurgy and configuration, pad design and composition, current density, temperature, and current polarity.
Industry News | 2008-05-22 12:03:46.0
New Lead Free Solder Wire Improves Quality & Reduces Solder Tip Consumption
Industry News | 2019-01-30 20:37:50.0
Metcal today announced the global launch of the first Robotic Soldering System with patented Connection Validation (CV) technology and a touchscreen graphical user interface to drastically mitigate the risk of solder joint defects and add productivity to the manufacturers’ soldering process.
Industry News | 2017-06-05 15:45:06.0
YINCAE has developed a new innovative solder joint encapsulant paste. Designed to be used for mass production via dispensing or printing, SMT 256EP replaces traditional solder paste, flux, and underfill. SMT 256EP enhances solder joint strength by 5 to 10 times and has demonstrated high pull strength at both room and high temperatures (280°C).
Industry News | 2017-08-08 09:40:33.0
(Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.
Industry News | 2017-08-08 09:40:36.0
(Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.
Industry News | 2021-11-12 04:12:57.0
The perfect solder joint requires the perfect connection between the components because compromises lead to poor results, defects in the components and expensive rework. Weller's solder wire (WSW) platform provides only the best and exceeds expectations.
Industry News | 2010-03-03 14:29:02.0
OK International (www.okinternational.com) has launched a new soldering system for PV tabbing and bussing applications proven to reduce micro cracking. The PS900 with specially designed hoof tip geometry optimizes the power delivered to the solder joint while it’s temperature-sensitive heater ensures low temperature soldering thus minimizing thermally induced stresses on cell surfaces.
