Industry News | 2016-05-31 20:58:06.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2019-09-03 12:08:08.0
With the growing interest in the use of low temperature soldering and the use of solder paste in rework we have created the first training resources available to downoad at www.bobwillis.co.uk Training materials for use in your own onsite workshops or tailor made onsite hands on sessions. The training material feature training wall charts and a photo album of images to use in PowerPoint, reports or on websites
Industry News | 2010-10-04 17:16:14.0
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that it will highlight its SN100C P602 Solder Paste and NS-F900 Wave Soldering Flux in booth 226 at the upcoming SMTA International exhibition, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2021-01-21 18:51:54.0
Vinatronic has just upgraded its X-ray capabilities with a brand-new Glenbrook JewelBox 70T Real Time X-ray Inspection System.
Industry News | 2016-08-19 05:00:52.0
If you have a process problem, let NPL Defect of the Month Video help you team
Industry News | 2008-04-17 16:46:07.0
In what is truly a ground breaking material advance, Henkel Corporation has developed a new reflow cured encapsulant material that combines flux functionality and underfill protection into a single material. The breakthough product, Hysol� FF6000�, is a reflow curable material that is formulated to provide flux for lead-free solder joint formation and, when cured, delivers protection against mechanical stress.
Industry News | 2011-10-16 01:00:33.0
Cobar Solder Products will introduce its new halogen- and halide-free solder paste, Alpine OT2 in Booth #314 at the upcoming SMTA International Conference & Exhibition
Industry News | 2017-03-23 13:05:52.0
Metcal today announced plans to exhibit at NEPCON China, scheduled to take place April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center. The company will showcase its convection rework and hand soldering systems and tools, including the new CV-5200 Connection Validation™ Soldering Station and High Thermal Demand upgrade kit in Stand 1H39.
Industry News | 2015-09-22 20:41:43.0
ASC International today announced that its VisionPro HSi will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from Sept. 29-30, 2015 on the show floor. The experience is free to attend and is supported by CIRCUITS ASSEMBLY Magazine, SMTA and NPL.
Industry News | 2017-07-09 20:40:11.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
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