Industry News | 2019-09-03 12:08:08.0
With the growing interest in the use of low temperature soldering and the use of solder paste in rework we have created the first training resources available to downoad at www.bobwillis.co.uk Training materials for use in your own onsite workshops or tailor made onsite hands on sessions. The training material feature training wall charts and a photo album of images to use in PowerPoint, reports or on websites
Industry News | 2013-07-16 14:26:29.0
SEHO North America, Inc. announces that it has extended the upcoming Selective Soldering Seminar from the SEHO Academy with a ‘Reflow Day.’
Industry News | 2010-09-16 21:44:04.0
The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.
Industry News | 2015-09-30 16:26:02.0
Gen3 Systems Limited will exhibit both GEN3 Systems’ products and Optilia Inspection equipment in Booth #219 at the SMTA International Conference and Exhibition, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Ascentech LLC also will participate in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience on the show floor. The experience is free to attend and is supported by CIRCUITS ASSEMBLY Magazine, SMTA and NPL.
Industry News | 2018-10-18 09:02:41.0
How to Solder a Surface Mount Device to a PCB Pad
Industry News | 2013-02-12 13:15:17.0
SEHO Systems GmbH now offers a new technology for virtually void-free soldering results with the MaxiReflow HP.
Industry News | 2012-01-19 23:09:10.0
Viscom proudly announces that it will exhibit its recently introduced 3-D SPI system in Booth #2629 at the upcoming IPC APEX Expo. The system is now available with the unique SPI-AOI Uplink feature that provides better defect detection during post-reflow AOI, ensuring the lowest false alarm rates.
Industry News | 2015-09-14 17:31:42.0
Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation are pleased to announce that their products will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from Sept. 29-30, 2015 on the show floor of SMTAI. The experience is free to attend and is supported by CIRCUITS ASSEMBLY Magazine, SMTA and NPL.
Industry News | 2017-06-05 15:45:06.0
YINCAE has developed a new innovative solder joint encapsulant paste. Designed to be used for mass production via dispensing or printing, SMT 256EP replaces traditional solder paste, flux, and underfill. SMT 256EP enhances solder joint strength by 5 to 10 times and has demonstrated high pull strength at both room and high temperatures (280°C).
Industry News | 2016-09-07 18:44:03.0
KYZEN announces that Dr. Mike Bixenman will present the recent paper entitled, “Reactivity of No-Clean Flux Residues Trapped Under Bottom Terminated Components” during SMTA International. The paper is co-authored by Bruno Tolla, Ph.D., Jennifer Allen and Kyle Loomis from Kester and will be presented during the “Flux, Solder, Adhesives Track” on Tuesday, September 27, 2016 at 3 p.m.
