Industry News | 2012-08-01 16:35:04.0
The SMTA announced that the Lead-Free Soldering Technology Symposium will be held on October 18, 2012 as a focused symposium at SMTA International in Orlando, FL.
Industry News | 2018-10-11 19:15:17.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13-15, 2018 at Chicago Marriott, Schaumburg, Illinois. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.
Industry News | 2012-03-08 22:21:34.0
The SMTA is pleased to announce the program for the 2012 International Conference on Soldering and Reliability being held May 15-18 in Toronto, Ontario, Canada. Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto since 2007, this conference will bring together the community of soldering and reliability experts. The event will be co-located with the SMTA Lead-Free Academy and the SMTA Toronto Expo.
Industry News | 2003-05-01 08:15:48.0
Will take place February 23-27, 2004, at the Anaheim Convention Center in Anaheim, Calif.
Industry News | 2018-12-08 03:22:25.0
Electronic Components, Parts and Their Function
Industry News | 2008-08-14 13:20:36.0
ROSEMONT, IL � Industry-leading associations IPC and SMTA announce that Linda Woody will keynote Day 2 of the jointly sponsored High-Performance Electronics Cleaning Symposium to be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
Industry News | 2014-08-04 18:37:09.0
The SMTA announced that the Lead-Free Soldering Technology Symposium will be held on October 2, 2014 as a focused symposium at SMTA International in Rosemont, Illinois.
Industry News | 2019-03-18 08:30:09.0
IPC’s popular standards, J-STD-001, recognized globally for its criteria on soldering processes and materials, and IPC-A-610, the most widely used electronics assembly acceptance document, complement each other when used together. IPC offers a new technical education course, Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together, to provide instruction on how best to use these documents jointly.
Industry News | 2021-03-25 15:48:41.0
The SMTA Officer team is excited to provide our members with a new webinar by Dr. Nathan Blattau, R&D Fellow at Ansys, Inc., on "Next Generation Lead Free Solders for High Reliability and SMT Yield improvement in Client Computing Systems." The webinar will be on Tuesday, April 6th at 12:00 PM EST and will discuss the evolution of lead free (Pb-free) solder, from tin-silver-copper (SAC) system with silver content of 3.0 and 4.0 to low SAC solders and the emergence of high reliability Pb-free solder. It will cover the reasons and the driving forces of industries implementing this change.
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