Industry News: solder mask adhesion (Page 3 of 97)

IPC Releases Additional Test Coupons for the IPC-2221B Gerber Coupon Generator Test Coupons provide structural integrity verification based on current printed board design technology

Industry News | 2018-05-22 12:19:27.0

IPC – Association Connecting Electronics Industries® would like to announce the release of additional test coupons for the IPC-2221B Gerber Coupon Generator, an exclusive annual subscription service for IPC member companies. The IPC-2221B Gerber Coupon Generator subscription service is the only service providing new, industry approved test coupons addressing blind, buried, stacked and staggered via structures. The most commonly used coupons for product acceptance are “AB,” “AB/R” and “D” which were introduced in 2016.

Association Connecting Electronics Industries (IPC)

IPC Presents Technical Education Course: PCB Troubleshooting Course held in conjunction with PCB Carolina

Industry News | 2016-09-14 17:44:33.0

IPC – Association Connecting Electronics Industries® will present “PCB Troubleshooting” on November 2, 2016 in Raleigh, N.C. in conjunction with regional trade show, PCB Carolina.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for IPC Midwest Conference & Exhibition

Industry News | 2012-03-09 17:47:15.0

IPC has issued a Call for Participation for the technical conference at IPC Midwest Conference & Exhibition™. The one show in the Midwest focused on printed boards and electronics manufacturing, this year’s event will take place August 22–23, 2012, at the Renaissance Schaumburg Convention Center in Schaumburg, Ill. Researchers, academics, technical experts and industry leaders are invited to submit abstracts on the materials and processes that contribute to the performance of printed board assemblies.

Association Connecting Electronics Industries (IPC)

IPC Calls for Participation in Electronics Materials Forum

Industry News | 2020-02-18 14:50:19.0

IPC invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Electronics Materials Forum – From Fabrication to Assembly – to be held June 18, 2020 in Raleigh, N.C., in conjunction with IPC SummerCom.

Association Connecting Electronics Industries (IPC)

Session 6 Agenda Is Finalized for the High-Rel Cleaning and Coating Conference Hosted by IPC and SMTA

Industry News | 2012-11-07 11:01:55.0

IPC and SMTA jointly announce the agenda for Session 6 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.

Association Connecting Electronics Industries (IPC)

IPC Conference to “Clean Up” Reliability Problems

Industry News | 2013-10-28 16:31:54.0

IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for Electronics Materials Forum Presentations sought on emerging technologies

Industry News | 2019-04-14 18:51:44.0

IPC -- Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit presentation topics and descriptions for IPC Electronics Materials Forum, a new technical conference focusing on developments in materials and processes associated with electronics assembly and manufacturing. The conference will be held in Minneapolis, Minn., November 5-7, 2019.

Association Connecting Electronics Industries (IPC)

Count On Tools Offers Glue Dispense Nozzles for Universal Instruments’ GDM Line

Industry News | 2010-11-24 13:31:13.0

Count On Tools Inc., a leading provider of precision components and SMT spare parts, announces that it now offers Glue Dispense Nozzles for the Universal Instruments GDM line of equipment.

Count On Tools, Inc.

Douglas Pauls Elected to Chair IPC's Top Standards Development Leadership Committee

Industry News | 2012-03-07 19:35:54.0

IPC announces the election of Douglas Pauls, principal materials and process engineer, Rockwell Collins, to chair the IPC Technical Activities Executive Committee (TAEC) for a two-year term. Elected to the position by the chairs and co-chairs of all IPC standards groups, Pauls succeeds Mel Parrish of STI Electronics, Inc. who held the role for IPC’s top standards development oversight committee for the past two years.

Association Connecting Electronics Industries (IPC)

Updates to IPC-6012 and IPC-A-600 Released: Five Years of New Board Technologies and Processes Bring Significant Changes to Specifications.

Industry News | 2010-04-10 02:09:54.0

If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.

Association Connecting Electronics Industries (IPC)


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