Industry News | 2008-04-08 22:33:32.0
COLORADO SPRINGS, CO � April 2, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces that it has been awarded a SMT VISION Award in the category of Assembly Tools for its innovative Slick-Blade Squeegee Blades. The award was presented to the company during a Wednesday, April 2, 2008 ceremony that took place in Las Vegas during APEX 2008.
Industry News | 2008-07-19 14:36:57.0
COLORADO SPRINGS, CO � July 16, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces that it has been awarded an Advanced Packaging Award in the category of Handling Equipment/Fixtures for its innovative Slick-Blade Squeegee Blades. The award was presented to the company during a Wednesday, July 16, 2008 ceremony that took place at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco.
Industry News | 2011-01-18 12:16:31.0
Nihon Superior Co. Ltd. announces that company President Tetsuro Nishimura will present a paper titled “Recent Developments in the Application of Sn-Cu-Ni+Ge Lead-free Solder and Halogen-free Fluxes” at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.
Industry News | 2012-01-13 12:58:39.0
Nihon Superior announces that President Tetsuro Nishimura will present two papers at the upcoming SMTA Pan Pacific Microelectronics Symposium, scheduled to take place February 14-16, 2012 at the Sheraton Poipu Resort in Kauai, Hawaii.
Industry News | 2009-03-12 18:45:55.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that Keith Sweatman, Nihon Superior Co. Ltd.'s Senior Technical Advisor, will present a paper titled �Hot Air Solder Levelling in the Lead-free Era� at the upcoming APEX Conference and Exhibition. The presentation will take place during Session 28, titled Surface Finishes, on Thursday, April 2, 2009 from 9-10 a.m.
Industry News | 2013-03-25 14:58:02.0
IMS has introduced a new type or chip resistor terminal which are non‐magnetic and ultra leach resistant.
Industry News | 2019-08-21 17:00:15.0
Nihon Superiorwill exhibit in Booth #518 at 2019 SMTA International. The company will celebrate the achievements produced by the well-known SN100C® lead-free alloy. TipSave N flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.
Industry News | 2009-04-08 15:48:25.0
DENVER � April 2009 � Krayden, Inc., a leading distributor of engineered materials and Dow Corning's Distributor of the Year, announces that it will exhibit technologies from its industry-leading suppliers in booth 1141at the upcoming NEPCON East Exhibition and Conference, scheduled to take place April 22-23, 2009 at the Boston Convention & Exhibition Center in Boston, MA.
Industry News | 2018-09-11 19:30:04.0
Nihon Superior Co.has developed a new flux-cored solder wire that greatly reduces spatter compared with conventional cored wire. The new cored-flux, (032) allows the use of a wide range of soldering iron tip temperatures with very little spatter, even with high tip temperatures.
Industry News | 2008-04-08 01:17:22.0
OSAKA, JAPAN � March 4, 2007 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry announces that it is contributing a paper, �Impact Strength of Lead-free BGA Spheres,� to the 18th Shanghai International SMT High Level Conference that is part of NEPCON China 2008 which is scheduled to take place from April 8 to April 11, 2008 at Shanghai Everbright Convention and Exhibition Centre.
