Industry News: solder on enig from reflow[0] (Page 1 of 1)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

Bonding Flip Chips on to Flexible Circuit Boards

Industry News | 2011-01-18 13:46:21.0

Time and again, a major challenge lies in attaching integrated circuits (ICs) to highly integrated circuit board substrates in a space-saving manner. Würth Elektronik took this challenge on and found an ideal solution with the ESC (encapsulated solder connection) process. The chips are soldered and at the same time glued 'face-down" in their exact position.

Würth Elektronik GmbH & Co. KG

Averatek to Present "Reliability of Solder Joints on Flexible Aluminum PC Boards" at SMTAI

Industry News | 2021-10-07 15:38:24.0

Averatek is pleased to announce that it will present a paper during the during the SMTA International Conference Nov. 1-4, 2021 at the Minneapolis Convention Center. Divyakant Kadiwala, Nazarali Merchant, Ph.D., and Benny Lam co-authored "Reliability of Solder Joints on Flexible Aluminum PC Boards."

Averatek Corporation

MacDermid Alpha to Promote Latest Interconnect Technologies and Present on Microvia Reliability at the 2021 Virtual IPC APEX Exhibition and Conference

Industry News | 2021-02-25 13:41:10.0

MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.

MacDermid Alpha Electronics Solutions

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