Industry News | 2009-04-23 21:52:53.0
MYDATA's Jet Printer MY500 received the SMT 2009 VISION Award in the category �Solder Paste Printing - Jetting & Others�. The award was handed out during a ceremony at NEPCON Shanghai on April 21st, 2009.
Industry News | 2016-07-13 16:54:57.0
Seika Machinery is pleased to introduce the Malcom SP-2 Wetting Tester. The SP-2 helps to test the wettability of solder paste and components while actually simulating the SMT mounting and reflow process.
Industry News | 2012-08-23 12:36:58.0
Smyczek GmbH & Co. KG, based in Verl, Germany, announces that it has optimized its SMT processes with the implementation of 3D paste inspection with Process Uplink by Viscom.
Industry News | 2018-03-16 08:13:49.0
As a leading solder materials innovator, Henkel recognizes the need for more holistic solder paste process analysis, especially as device miniaturization and finer particle size solders become mainstream. While many suppliers and manufacturers use proprietary solder material evaluation tools, there is a requirement for easily-implemented, standardized test vehicles that address the realities of today’s manufacturing complexities, particularly in the process areas of printing and reflow. The electronics business of Henkel Adhesive Technologies has developed such a tool.
Industry News | 2024-05-13 10:16:58.0
ZESTRON is pleased to announce an upcoming webinar titled "Advancements in Solder Paste Printing: Cleaning Compatibility of Jettable and Screen-Printable Solder Pastes in Advanced Electronic Assemblies," scheduled for May 16, 2024, at 2:00 PM EDT.
Industry News | 2018-04-30 16:02:25.0
Seika Machinery today announced that it has a demo unit available for the new Malcom SPS-2000 Solder Paste Mixer. This new version adds a number of new functions to make sure your paste is at its optimum condition for use.
Industry News | 2013-09-30 18:14:34.0
Free Session, Spotlight 4, October 16, 2013 from 9:30-11:00 AM
Industry News | 2010-04-28 21:43:42.0
Following a successful evaluation period, DEK’s ProFlow® ATx enclosed print head technology has been adopted by a high profile electronics company due to its ability to meet complex mass production requirements. As specialists in design, production and product management, the electronics solutions company had strict evaluation criteria that the DEK system successfully met and even, in some cases, exceeded.
Industry News | 2002-04-09 08:02:34.0
QuickStart, Was the Result of More than Two Years of Collaborative Research and Development Between Indium and Motorola
Industry News | 2017-09-20 15:08:48.0
Viscom AG today announced the adoption of the Valor® Process Preparation technology from Mentor, a Siemens business, for its Viscom vVision SPI and AOI systems. Recognized globally for providing superior 3D optical and X-ray inspection systems for electronics manufacturing, Viscom is seeing important benefits in using this additional tool. When combined with Valor Process Preparation software, the efficiency of the machines is significantly enhanced.
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