Industry News | 2018-10-18 10:13:08.0
The Application of the Pin-in-Paste Reflow Process
Industry News | 2019-01-05 16:48:58.0
Practical Components is a premier supplier to the global electronics industry specializing in mechanical IC samples or “dummy” components, evaluation PCBs and solder training kits. Practical will feature its latest technology in booth 1609 at the upcoming IPC APEX EXPO 2019 exhibition and convention, scheduled to take place January 29-31, 2019 at the San Diego Conference Center in California.
Industry News | 2016-01-12 01:45:47.0
Yamaha Motor IM announced today that Alpha ('Alpha Metals') has chosen the YAMAHA YCP10 High-Performance Compact Printer for purchase and installation at a key laboratory facility in New Jersey. After rigorous print testing, the YCP10 demonstrated the ability to deliver the consistent printing results that the Alpha evaluators were seeking.
Industry News | 2023-05-22 18:45:34.0
SHENMAO America, Inc. is proud to announce the release of its new SMBF-08 Visible No-Clean BGA Flux. This innovative flux is specifically designed to meet the demands of surface mount technology (SMT) assembly and BGA ball mount processes, offering enhanced visibility and performance.
Industry News | 2016-02-10 17:03:46.0
MET Stencil announces the launch of the NanoSlic® Gold stencil. NanoSlic® is the world's most advanced stencil coating technology for improving solder paste printing. "We are pleased to announce that we have been licensed by FCT Assembly to sell this coating to the US market.” said Fred Cox, President of MET Stencil. "Stencil users will immediately see the benefits in their print."
Industry News | 2014-01-22 11:00:42.0
FCT Assembly announces the launch of the NanoSlic® Gold stencil. NanoSlic® is the world’s most advanced stencil technology for solder paste printing.
Industry News | 2014-11-22 07:42:40.0
FCT Assembly today announced plans to exhibit at the Space Coast and Tampa Bay Expo & Tech Forum, scheduled to take place Thursday, December 4, 2014 at the Park Inn by Radisson in Kissimmee, FL. Solder expert Rodney Wade will be available to discuss FCT’s NanoSlic® Gold stencil and line of solution-driven solder pastes.
Industry News | 2011-10-07 22:49:53.0
Deltec Automotive GmbH & Co. KG, based in Furth im Wald, has selected Viscom’s 3-D solder paste inspection system.
Industry News | 2018-10-15 18:31:07.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2018-10-18 19:55:33.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.