Industry News | 2012-01-19 23:09:10.0
Viscom proudly announces that it will exhibit its recently introduced 3-D SPI system in Booth #2629 at the upcoming IPC APEX Expo. The system is now available with the unique SPI-AOI Uplink feature that provides better defect detection during post-reflow AOI, ensuring the lowest false alarm rates.
Industry News | 2023-10-31 18:58:18.0
SHENMAO America, Inc. is proud to announce that it received a 2023 Mexico Technology Award for its groundbreaking SMBF-08 Visible No-Clean BGA Flux. The award was announced at a ceremony on Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo. This innovative flux has redefined surface mount technology (SMT) assembly and BGA ball mount processes, offering unparalleled visibility and performance.
Industry News | 2013-01-21 20:44:37.0
Etek Europe Ltd has invested in a Parmi SPI HS70 Solder Paste Inspection System for its new custom-built Technology Center in the UK.
Industry News | 2015-02-10 17:26:13.0
Practical Components announces that it will display its latest technology in booth 3939 at the upcoming IPC APEX EXPO 2015 exhibition and conference, scheduled to take place February 24-26, 2015 at the San Diego Conference Center in California.
Industry News | 2018-10-02 17:16:16.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming iMAPS 2018 – Pasadena 51st International Symposium on Microelectronics exhibition and conference, scheduled to take place October 9-11, 2018 at the Pasadena Convention Center in California.
Industry News | 2014-08-25 16:35:50.0
FCT Assembly will exhibit in Booth #221 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2014-08-14 21:44:44.0
Several Indium Corporation experts will share their technical knowledge with attendees at the Surface Mount Technology Association's International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill.
Industry News | 2014-07-24 10:09:05.0
With this new Release, Viscom introduces numerous innovations and improvements in the area of inspection plan generation and analysis software for its inspection systems.
Industry News | 2004-06-24 17:35:13.0
New Lead-Free validation kit and service smoothes transition to "green" electronic assembly.
Industry News | 2017-08-06 19:34:44.0
KYZEN is pleased to announce that Dr. Mike Bixenman, DBA, received the ‘Best of Presentation’ Award at the 2017 International Conference on Soldering and Reliability (ICSR) for his paper entitled “Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach.” The award is determined through the evaluations of those that attended the presentation.
