Industry News | 2017-08-06 19:34:44.0
KYZEN is pleased to announce that Dr. Mike Bixenman, DBA, received the ‘Best of Presentation’ Award at the 2017 International Conference on Soldering and Reliability (ICSR) for his paper entitled “Reliable Microelectronic Assembly Process Design Test Methods – A Non-Standard Approach.” The award is determined through the evaluations of those that attended the presentation.
Industry News | 2022-10-20 06:51:24.0
ZESTRON is pleased to announce that the ZESTRON Americas team will be presenting at the SMTA International Expo & Tech Forum.
Industry News | 2008-08-07 15:26:07.0
Nihon Superior will feature a new, expanded range of SN100C products with FCT Assembly, one of its US SN100C Global Partners, in booth 125 at the upcoming SMTA International exhibition and conference.
Industry News | 2017-11-15 20:21:17.0
Viscom announces that it was awarded a 2017 Global Technology Award in the category of Inspection – SPI. The award was presented to the company during a ceremony on Tuesday, Nov. 14, 2017 that took place during productronica in Munich, Germany.
Industry News | 2008-12-15 15:28:33.0
LOS ALAMITOS, CA - December 2008 - With the wide acceptance of Amkor's FusionQuad� (VQFP/HVF-PQFP), Practical Components has added two new test boards to its lineup. FusionQuad� packages are leadframe-based plastic offering the effective integration of ExposedPad TQFP and MLF� technologies. FusionQuad� not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50 percent reduction in package size for a given leadcount.
Industry News | 2019-09-25 16:15:46.0
Practical Components announces that it will exhibit in booth 31 at the 2019 International Wafer-Level Packaging Conference (IWLPC) from October 22-23, 2019 at DoubleTree by Hilton in San Jose, CA. Practical Components has added many new Test Wafers for miniaturized Surface Mount Technology (SMT) to its array of Dummy Components, Solder Training Kits and PCB Evaluation Kits.
Industry News | 2023-10-09 09:21:57.0
Indium Corporation is proud to count three of its experts amongst the presenters participating in the technical program at the upcoming IMAPS International Symposium on Microelectronics, October 3-5 in San Diego, California, U.S.
Industry News | 2013-05-17 09:15:54.0
FCT Assembly today announced that Field Application Engineer Tony Lentz has joined several IPC task groups.
Industry News | 2005-08-22 18:40:30.0
Indium Corporation�s Vice President of Technology, Dr. Ning-Cheng Lee, is featured on the cover of Electronics Manufacturing CHINA (EM China), the leading Chinese technical publication for the electronics manufacturing industry in China.
Industry News | 2024-05-20 10:57:52.0
Indium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado. The presentation, part of the Advanced Die Bond and Board Level Reliability session, will examine the findings from technical paper, The Challenges of High-Temperature Lead-Free Solder Paste for Power Discrete Applications.
