Industry News | 2013-07-19 11:33:18.0
IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.
Industry News | 2013-02-25 16:44:53.0
MYDATA has recently completed successful testing of a new low-temperature solder paste for jet printing.
Industry News | 2022-01-03 07:24:21.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its newly developed TempSave series during the 2022 IPC APEX Virtual EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center, San Diego, CA. The company also will showcase its TipSave N alloy along with SN100CV P608 and LF-C2 P608 solder pastes.
Industry News | 2024-09-23 20:42:25.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #2850 at the SMTA International Exposition, scheduled to take place October 22-24, 2024 at the Donald E. Stephen Convention Center in Rosemont, IL. The company also will showcase LF-C2 P608 solder paste.
Industry News | 2014-01-07 18:34:43.0
Nihon Superior Co. Ltd. announced that it will exhibit in EAST 3-27 at the upcoming INTERNEPCON 2014, scheduled to take place January 15-17, 2014 at the TOKYO BIG SITE in Tokyo, Japan.
Industry News | 2020-11-19 20:55:18.0
Temperature cycling test or thermal cycle testing is done on substances to determine the immunity of vulnerability to alternating extremes of low and high temperatures. You can utilize temperature cycling test chambers to test nearly all commercial goods to determine how they withstand extreme temperature changes. The intent of analyzing a product under these conditions is to detect changes in the goods' characteristics and assess the failure incidence of distinct substances and thermal expansion coefficients.
Industry News | 2014-08-26 16:19:51.0
Nihon Superior Co. Ltd. will exhibit in Booth #410 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2021-04-29 17:15:05.0
Indium Corporation's Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim, will present a paper on low-temperature first level interconnects during the virtual ICEP, May 12-14.
Industry News | 2010-01-17 22:28:38.0
OSAKA, JAPAN — January 2010 — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global electronics industry, announces that it will display a full range of products based on its unique lead-free solder SN100C in Booth # East 31-12 in the East 6 Hall of East Exhibit Building at the upcoming INTERNEPCON Japan 2010, scheduled to take place January 20-22, 2010 at the Tokyo Big Site.
Industry News | 2010-03-26 23:36:50.0
OSAKA, JAPAN - Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global electronics industry, announces that it will display a full range of products based on its unique lead-free solder SN100C in booth 1426 at the upcoming IPC/APEX conference and exhibition.
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