Industry News | 2021-04-29 17:15:05.0
Indium Corporation's Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim, will present a paper on low-temperature first level interconnects during the virtual ICEP, May 12-14.
Industry News | 2016-02-06 01:03:23.0
Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo.
Industry News | 2010-01-17 22:28:38.0
OSAKA, JAPAN — January 2010 — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global electronics industry, announces that it will display a full range of products based on its unique lead-free solder SN100C in Booth # East 31-12 in the East 6 Hall of East Exhibit Building at the upcoming INTERNEPCON Japan 2010, scheduled to take place January 20-22, 2010 at the Tokyo Big Site.
Industry News | 2010-03-26 23:36:50.0
OSAKA, JAPAN - Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global electronics industry, announces that it will display a full range of products based on its unique lead-free solder SN100C in booth 1426 at the upcoming IPC/APEX conference and exhibition.
Industry News | 2016-02-11 13:36:43.0
Indium Corporation's Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void™, while delivering high transfer efficiency with low variability.
Industry News | 2014-02-19 16:03:57.0
Nihon Superior Co. Ltd Nihon Superior will exhibit in Booth #2353 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
Industry News | 2015-01-19 21:20:27.0
Nihon Superior Co. will exhibit in Booth #739 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will showcase the SN100C P506 D4 lead-free, no-clean solder paste and Alconano Nano-Silver paste.
Industry News | 2008-12-15 15:28:33.0
LOS ALAMITOS, CA - December 2008 - With the wide acceptance of Amkor's FusionQuad� (VQFP/HVF-PQFP), Practical Components has added two new test boards to its lineup. FusionQuad� packages are leadframe-based plastic offering the effective integration of ExposedPad TQFP and MLF� technologies. FusionQuad� not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50 percent reduction in package size for a given leadcount.
Industry News | 2014-02-27 11:48:51.0
Several Indium Corporation technology experts will present at IPC APEX March 25-27 in Las Vegas, Nevada.
Industry News | 2021-06-17 15:18:27.0
Indium Corporation will feature proven products from its portfolio of high-reliability solder materials at the CEIA Wuhan Seminar on June 24 in Wuhan, China.
