Industry News: solder paste gets dry out (Page 2 of 9)

Seika Introduces New Solder Paste Testing Solutions at APEX

Industry News | 2020-01-07 11:22:42.0

Seika Machinery, Inc. today announced plans to exhibit at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. Seika will introduce the new PCU-285 Spiral Viscometer and DS-10S Dip Tester for Selective Solder from Malcom in Booth #3645.

Seika Machinery, Inc.

Shenmao Recycled Solder Materials to Be Certified to UL ECVP 2809

Industry News | 2022-09-08 06:51:46.0

Shenmao America, Inc. is pleased to announce that four of its solder materials have received UL ECVP 2809 (UL Environmental Claim Validation Procedure, UL ECVP) for Recycled Content Standard which now includes auditing of social responsibility procedures. Additionally, more of its recycled tin products will be UL certified in the near future.

Shenmao Technology Inc.

Get First-Class Performance with Dow Corning TC-5026 Thermal Grease from Krayden

Industry News | 2011-08-24 21:45:53.0

Krayden introduces TC-5026 Thermal Grease from Dow Corning. Designed with reliability in mind, TC-5026 is solvent-free for the highest stability.

Krayden Inc.

Visit SMTAI to Get the Latest Concentrated Aqueous Stencil Cleaner from Kyzen

Industry News | 2013-09-12 17:10:17.0

Kyzen will showcase AQUANOX® A8820 Advanced Aqueous Stencil Cleaner in Booth #302 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

KYZEN Corporation

Horizon Sales Wins the Mexico Technology Award for the New Mobile Sonic Stencil Cleaning System

Industry News | 2022-09-26 06:33:54.0

Horizon Sales is pleased to announce that it received a 2022 Mexico Technology Award in the category of Cleaning Equipment for its new Mobile Sonic Stencil Cleaning System. The award was announced during a ceremony that took place Wednesday, Sept. 21, 2022 during SMTA Guadalajara in Mexico.

Horizon Sales

Seika Machinery to Present Solutions to Optimize Production Processes at APEX 2024

Industry News | 2024-03-18 11:56:33.0

Seika Machinery, Inc. is gearing up to showcase its latest advancements at Booth 4012 during the 2024 IPC APEX EXPO, slated to take place April 9-11, 2024 at the Anaheim Convention Center in California. Renowned for its commitment to excellence and technological innovation, Seika Machinery will present an array of state-of-the-art equipment and systems designed to optimize production processes and enhance manufacturing efficiency.

Seika Machinery, Inc.

Lead-free processes propose new requirements on reflow soldering quality

Industry News | 2018-10-18 09:14:05.0

Lead-free processes propose new requirements on reflow soldering quality

Flason Electronic Co.,limited

FINETECH to Present at SMT/HYBRID/PACKAGING

Industry News | 2009-04-23 20:46:52.0

FINETECH Product Manager Dominik Horn will give a presentation titled �QFN Rework in OEM Quality� at the upcoming SMT/HYBRID/PACKAGING Exhibition & Conference, scheduled to take place Wednesday, May 6, 2009 from 1:40-2 p.m.

Finetech

MacDermid Alpha to Present Power Package Attach by Silver Sinteringat PCIM Asia Conference in Shanghai

Industry News | 2020-11-06 17:27:12.0

The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting the paper, "Power Package Attach by Silver Sintering – Process, Performance & Reliability" at the PCIM Asia Conference 2020 which will take place from November 16-18 in Shanghai, China.

MacDermid Alpha Electronics Solutions

Pin-in-Paste Reflow Calculations and Special Cases

Industry News | 2018-10-18 08:43:30.0

Pin-in-Paste Reflow Calculations and Special Cases

Flason Electronic Co.,limited


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