Industry News | 2012-07-24 08:11:29.0
Kyzen announces that Dr. Mike Bixenman will present at the upcoming technology symposium hosted by BEST, Inc. entitled, “Sharpening Your Tools-Area Array Technology,”
Industry News | 2023-10-30 19:21:14.0
Tresky GmbH from Hennigsdorf near Berlin will present various metallic pre-sintering processes, including the Die Transfer Film (DTF) process, at this year's productronica 2023 in Munich. Especially for bonding semiconductors such as IGBTs, SiC MOSFETs or GaN HEMTs with Ag on DBC or AMB substrates or for connecting power modules on heat sinks, metallic sintering offers a high-performance solution with maximum reliability.
Industry News | 2017-01-11 18:03:46.0
Juki Automation Systems will exhibit in Booth #2433 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. The company today announced plans to show several new products, including the AXI5100c inline X-ray component counter, SE600 SPI, RS-1 Placement Machine, and modular selective solder system.
Industry News | 2016-03-30 08:48:20.0
SEHO Systems GmbH will exhibit technology from nearly all product divisions in Hall 7, Booth 139 at the upcoming SMT/Hybrid/Packaging, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany. SEHO is the only manufacturer worldwide who offers customers systems for all fields of automated soldering, integrated solutions for optical solder joint inspection, intelligent concepts for board handling and material management, as well as efficient and ergonomic work places, engineering, and informational seminars.
Industry News | 2018-01-28 19:27:20.0
SEHO North America will highlight a full line of market leading soldering systems in Booth #3133 at the IPC APEX EXPO, scheduled to take place Feb. 27 – March 1, 2018 at the San Diego Convention Center.
Industry News | 2023-06-12 20:40:57.0
Atlanta, GA – Koh Young, the industry leader in True3D™ measurement-based inspection solutions, is pleased to announce its return to SEMICON West with a new series of inspection solutions designed to increase advanced package and semiconductor yield. Several of our latest inspection machines will be on display during SEMCION West in booth 329 from 11-13 July 2023 in the Moscone Center, San Francisco, CA.
Industry News | 2008-11-18 17:22:43.0
Moulded Interconnected Device (MID) applications are the current focus of the automotive and medical device industries. In such products, circuits are directly applied onto the surface of injection moulded plastic parts or are integrated as part of products. In a 3D-MID, SMD components typically are on multiple levels. Essemtec has developed a system that can dispense and place in three dimensions and is capable of placing 3D-MID technology.
Industry News | 2015-03-02 09:42:34.0
PORTLAND, MAINE – VisionMaster® introduced the first member of the VisionMaster 600 family, the latest in the evolution of the original VisionMaster® world-class benchtop SPI systems at APEX. The fully-automatic A600 features the smallest 3D non-contact SPI sensor head in the world, which was crafted by miniaturizing the technology in the popular A500X. A smaller sensor translates to a more efficient motion system, lower vibrations and settling time – which results in higher accuracies at higher speeds. A600's fully automatic set-and-forget SPI system is optimal for monitoring and tweaking your solder paste printing process. The standard A600 handles larger board sizes – 18 in. x 16 in. – and is very economical at $29,999.
Industry News | 2014-01-23 17:48:44.0
Juki Automation Systems (JAS), Inc.introduces its new RX-6 – a new modular mounter that combines high quality, flexibility and productivity.
Industry News | 2012-08-13 14:26:39.0
Aqueous Technologies, Henkel, Kyzen, PVA and STI Electronics, Inc. will join forces to present valuable solutions to today’s most challenging cleaning and reliability issues on Thursday, September 13, 2012 at the Holiday Inn Huntsville-Research Park in Huntsville, AL.
