Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2018-12-08 03:35:10.0
Top 10 Consumer Electronics Companies in the World
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2010-05-29 18:05:27.0
Christopher Associates Inc. today introduced a powerful new yield improvement tool for the solder paste printing process. SPC+ Software, developed by Koh Young Technology, is a high-functionality statistical process control (SPC) package that can be run on the system or offline. The new software is included free of charge on all new Koh Young equipment.
Industry News | 2020-10-29 08:09:43.0
Essemtec announces that it was awarded a 2020 Mexico Technology Award in the category of Dispensing for its new Archerfish. The award was announced during a Virtual Awards Ceremony on Monday, October 26, 2020.
Industry News | 2001-12-20 09:01:19.0
The new automatic pick&place system CSM7000 from ESSEMTEC is a precise machine for the assembly of SMD components onto printed circuits
Industry News | 2021-10-07 15:33:28.0
Essemtec will exhibit at the the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. The company will highlight its dispensing solution for both the electronics and medical industries in Booth #3520.
Industry News | 2014-03-25 18:52:14.0
An innovative Android-based operating system and high-resolution touchscreen user interface only begin to explain why Manncorp’s new MC-301 Benchtop Reflow Oven is among its hottest new products for 2014. By simulating the environment of an inline reflow system in a small footprint, the MC-301 is ideal for prototyping, manufacturability testing, and even short-run batch production. Its exclusive Android control app allows surface mount assemblers and product developers to meet solder paste manufacturers’ precise specifications for the preheat, soak, reflow, and cooling phases of their recommended profiles. Heating and cooling rates in each stage are also automatically calculated to easily verify compliance with component and material requirements.
Industry News | 2019-01-22 08:57:36.0
Seoul, South Korea – Koh Young Technology, the industry’s leading smart factory solutions provider, will highlight latest process optimization solution with its KY8030-3 3D SPI for solder paste printing at APEX show during 29-31 January 2019 at the San Diego convention center. The Koh Young Process Optimizer (KPO) solution is a comprehensive process optimization solution suite, which maximizes throughput and increases ROI by recommending optimal print parameters.
Industry News | 2014-08-14 21:44:44.0
Several Indium Corporation experts will share their technical knowledge with attendees at the Surface Mount Technology Association's International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill.
