Industry News: solder paste senju 3 (Page 13 of 143)

Jim Raby to Deliver Keynote at Atlanta SMTA Expo

Industry News | 2008-02-07 20:41:29.0

February 7, 2008�The Surface Mount Technology Association (SMTA) announced today that Jim Raby, renowned 50-year industry veteran, and founder, technical director and program manager at STI Electronics (Madison, AL), will present the morning keynote, �An Industry Perspective: Past, Present and Future,� from 9:30 � 10:30 am.

Surface Mount Technology Association (SMTA)

SMTA International 2015 Concludes Successfully

Industry News | 2015-10-13 18:52:09.0

SMTA International Conference and Exhibition, which took place September 27 – October 1, 2015 at the Donald E. Stephens Convention Center in Rosemont, IL, experienced a 20% increase in on-site attendance compared to 2014. International attendance was comparable to last year with attendees representing 21 different countries.

Surface Mount Technology Association (SMTA)

SMTA Capital Chapter to Host Chapter Tutorial Program on March 15th

Industry News | 2018-01-31 17:46:49.0

The SMTA Capital Chapter is pleased to announce that it will host a Chapter Tutorial Program on March 15th from 9AM to 3PM in Rockville, MD. Phil Zarrow, ITM consulting, will present “Understanding and Implementing Best Practices in Electronic Assembly Processes”.

Surface Mount Technology Association (SMTA)

SMTA Beantown Bonanza

Industry News | 2003-04-10 07:58:34.0

The answers that you need to stay competitive in today's market

Surface Mount Technology Association (SMTA)

SMTA Boston Chapter Meeting on SMT Stencils at Rick’s Café in Billerica Center on Tues., January 24th, 2012

Industry News | 2012-01-13 13:27:59.0

The SMT stencil market has a slew of new options in foil materials, coatings and cutting technologies, all of which promise to improve the solder paste printing process. Which of these options really do help assemblers keep yields up and costs down, and which don’t?

Surface Mount Technology Association (SMTA)

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for High Reliability Forum

Industry News | 2023-04-17 08:38:56.0

IPC is now accepting abstracts for the High Reliability Forum, the international conference focusing on Class 3 and safety critical electronics for mil-aero, automotive, medical, and long-life applications that are subjected to harsh use environments. The High Reliability Forum will be held October 17-19, 2023, at the Hilton Baltimore BWI Airport in Linthicum (Baltimore), Md.

Association Connecting Electronics Industries (IPC)

SMTA China Presents Awards at SMTA China East 2010 Conference/Nepcon China 2010

Industry News | 2010-04-30 18:47:15.0

SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.

Surface Mount Technology Association (SMTA)

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2015-06-17 14:05:18.0

The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open. The conference will be held at the Donald Stephens Convention Center in Rosemont, Illinois on September 27 - October 1, 2015. This year's program allows the attendee to choose from 19 courses, 120 technical papers, three focused symposia, and numerous complimentary offerings throughout the conference and exhibition

Surface Mount Technology Association (SMTA)

SMTA International Technical Program Expands, Includes Research from HDPUG and AREA Consortium

Industry News | 2017-07-23 20:13:17.0

SMTA announces an expanded program for the final day of the SMTA International Conference, September 17 - 21, 2017 in Rosemont, Illinois. In addition to the Lead-Free Symposium, the technical committee expanded the Thursday program to four concurrent tracks. The three additional tracks will focus on Advanced Packaging Technology, Manufacturing Excellence, and Inspection Technologies.

Surface Mount Technology Association (SMTA)


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