Industry News | 2010-01-13 20:08:34.0
MYDATA is proud to announce the certification of a new leaded solder paste from leading paste supplier, AIM, for the MYDATA MY500 Jet Printer. The certification is the latest success in AIM and MYDATA’s ongoing work to develop superior jet printing technologies, and follows the launch of AIM’s lead-free paste for the MY500 in 2009.
Industry News | 2017-10-17 20:32:02.0
Inventec presents a new ultra low voiding formula, Ecorel Free 305-16LVD to achieve optimal voiding performance in automotive, power electronics, LED lighting and other high reliability applications, without degradation of high speed printability and chemical reliability. Solder voiding is a complex phenomenon under the combination of many interactions affecting both the reliability and quality of solder joints, in such interactions solder paste is a key contributor.
Industry News | 2009-09-26 16:26:35.0
MYDATA announces that the two leading solder paste partners, Alpha and AIM, releases solder paste designed and qualified for the MYDATA MY500 Jet Printer.
Industry News | 2012-04-06 19:44:17.0
In SMT electronic assembly production, 3-D SPI has established itself as the additional inspection gate to complement optical or X-ray inspection.
Industry News | 2020-12-11 20:33:25.0
SunzonTech give fresher a short introduction of a full automatic solder paste printer's working process. It is really benefit for a fresher. Take a look at it!
Industry News | 2013-11-15 17:04:20.0
The popularity of jet printing technology to apply solder paste to printed circuit boards is growing fast as more and more electronics manufacturers understand the key advantages over traditional methods of solder paste application, such as screen printing or dispensing. Today hundreds of electronic producers worldwide are using jet printing for a diverse range of applications – situations that demand speed, design freedom and high-quality solder joints.
Industry News | 2018-09-18 20:11:02.0
Nihon Superior Co.today announced plans to exhibit in Booth #511 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will showcase the new SN100CVTM P608 D4 solder paste, NS-F851 rosin-based flux, ALUSAC-35 alloy and Alconano Nano-Silver paste.
Industry News | 2016-08-04 19:52:27.0
SAKI America announces the expansion of its sales network with the addition of three new representatives. Assembly Solutions, JW Sales, and Marketing Engineers of Ohio, Inc. (MEO) will provide sales support for Saki's complete line of 2D and 3D automated optical, solder paste, and x-ray inspection systems.
Industry News | 2019-08-17 11:50:22.0
OSAKA, JAPAN — August 2019 — Nihon Superior Co. Ltd., an advanced joining material supplier, today announced plans to exhibit in Booth #1G08 at the NEPCON ASIA (NEPCON SOUTH CHINA) Show, scheduled to take place Aug, 28-30, 2019 at the Shenzhen Convention & Exhibition Center in China. The company will celebrate the achievements produced by the well-known SN100C® lead-free alloy. TipSave N flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.
Industry News | 2019-10-29 15:52:14.0
Nihon Superior Co. Ltd. is pleased to announce the introduction of its new TipSave N flux-cored solder wire. The newly developed TipSave N flux-cored solder wire extends soldering iron tip life by 3X.
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