Industry News | 2012-08-03 08:30:27.0
Omron Inspection Systems (www.omron247.com) will display and demo its latest concepts and enhancements in AOI systems at the 2012 IPC Midwest Conference & Exhibition
Industry News | 2012-06-09 14:33:06.0
To help designers and board assemblers address the challenges of working with new materials and smaller, finer-pitch components, IPC – Association Connecting Electronics Industries® released the B revision of IPC-7525, Stencil Design Guidelines.
Industry News | 2018-02-07 17:52:33.0
The SMTA Capital Chapter is pleased to announce that it will host a Chapter Tutorial Program on March 15th from 9AM to 3PM in Rockville, MD. Phil Zarrow, ITM consulting, will present “Understanding and Implementing Best Practices in Electronic Assembly Processes”.
Industry News | 2018-10-18 09:14:05.0
Lead-free processes propose new requirements on reflow soldering quality
Industry News | 2008-09-21 01:46:38.0
ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Joe Russeau (Session Chair) of Precision Analytical Laboratory, Dr. Bev Christian of Research in Motion, Dave Hillman of Rockwell Collins, Matt Kehoe of Sipad Systems, and Doug Schueller of AbleConn will present during Session 3 on Building to Customer Reliability Standards in Class 2 and Class 3. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
Industry News | 2018-12-08 03:25:54.0
Basic Soldering Guide – How to Solder Electronic Components
Industry News | 2018-10-18 08:55:30.0
Nitrogen Protection Reflow Oven
Industry News | 2011-01-22 00:27:29.0
Design, assembly, soldering, repair, rework, inspection, and materials choice are all variables to be juggled as electronics manufacturers worldwide work with new component types, high speed signals and lead-free technology. To assist them in making the best choices for producing reliable electronics, IPC — Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22–24 February 2011.
