Industry News | 2010-06-04 17:48:10.0
TORRANCE, CA — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that with the implementation of its patent pending Solder Paste Recycling (SPR) unit, Seika is able to reduce the amount of waste material to less than 10 percent of current volumes by recycling solder paste.
Industry News | 2016-04-18 11:31:46.0
Kester will be exhibiting together with Speedline and Vitronic Soltec (booth # 1G40, Hall 1) at SMTA China East Conference 2016 which will be held in conjunction with NEPCON China 2016 in Shanghai on April 26-28.
Industry News | 2010-10-27 18:31:39.0
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it has been awarded a Global Technology Award in the category of Environmentally Friendly Products/Services for its Solder Paste Recycling (SPR) unit.
Industry News | 2015-05-13 14:00:03.0
The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.
Industry News | 2013-04-08 19:29:43.0
AIM Solder will highlight its new NC259 Solder Paste in Booth #1A26 at NEPCON China 2013, scheduled on the 23rd - 25th of April, 2013 at the Shanghai World EXPO Exhibition & Convention Center.
Industry News | 2016-09-26 20:00:28.0
SHENMAO America, Inc. is the American subsidiary of SHENMAO Technology, Inc. of TaoYuan City 328, Taiwan. Shenmao is a global leader of superior solder materials with 10 manufacturing, technical and sales support facilities located around the world. SHENMAO America, Inc. manufactures solder paste in San Jose, CA, U.S.A., supporting a wide range of products for the PCBA and Semiconductor Industries.
Industry News | 2013-03-18 17:06:13.0
AIM Solder announces that it will highlight its new NC259 Solder Paste in representative smartTec GmbH’s booth, which is located in Hall 7, Booth 219 at the upcoming SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Industry News | 2017-06-05 15:45:06.0
YINCAE has developed a new innovative solder joint encapsulant paste. Designed to be used for mass production via dispensing or printing, SMT 256EP replaces traditional solder paste, flux, and underfill. SMT 256EP enhances solder joint strength by 5 to 10 times and has demonstrated high pull strength at both room and high temperatures (280°C).
Industry News | 2012-10-16 15:06:07.0
Semblant Ltd. today announced it has expanded its equipment portfolio with the launch of the SPF 1000 and SPF 1500 Plasma Systems. Both systems deliver volume production capability for applying the patented Semblant Plasma Finish (SPF) and are only available from Semblant.
Industry News | 2017-01-30 20:02:15.0
Featuring how to solve Solder Paste issues such as Voids, Head on Pillow, Slumping, Non-Wetting Open and Short Stencil Life with Higher Quality Flux and Extremely Pure Virgin Powder made by SHENMAO, Resulting in Solder Joints of Ultimate Quality.
