Industry News: solder paste water soluble m705-515a-hn (Page 15 of 23)

Aqueous Technologies Introduces StencilWasher MP � The Vertical Format Misprint and Stencil Cleaning System

Industry News | 2009-02-11 23:36:26.0

RANCHO CUCAMONGA, CA � February 2009 � Aqueous Technologies Corp. announces the StencilWasher MP, a fully automatic misprint and stencil cleaning system that is designed to remove non-reflowed solder paste and adhesives from misprinted assemblies, stencils, and screens, as well as post-reflow circuit assemblies.

Aqueous Technologies Corporation

SHENMAO Presents Technical Paper at SMTA/ICSR Conference

Industry News | 2016-04-21 00:17:09.0

SHENMAO Technology will present the technical paper "A New Dispensing Solder Paste for Laser Soldering Technology" at the 10th. Anniversary of the SMTA International Conference of Soldering and Reliability 2016 in Toronto, Canada, featuring advancements in newly developed composition of Powder, Fluxes and produces best dispensability, minimal flux residue, no-splash or solder balling issues and minimal and smaller voids.

Shenmao Technology Inc.

Aqueous Technologies to Unveil New Trident Model at the 2012 IPC APEX Expo

Industry News | 2012-01-19 23:21:13.0

Aqueous Technologies will unveil the new Trident X in Booth #3029 at the upcoming IPC APEX Expo.

Aqueous Technologies Corporation

Blue Thunder Technologies to Showcase ESD Products at SMTA International 2008

Industry News | 2008-08-07 14:42:08.0

EAST WINDSOR, CT � August 2008 � Blue Thunder Technologies Inc., a manufacturer of high-quality wiping products and a supplier of consumable items used in cleanrooms, assembly lines, laboratories and manufacturing, announces that it will feature its friendly green� wipes, THE AQUAVATORTM stencil wiping fabric, the Green Monster stencil wiping roll and antistatic wipes in booth 302 at the upcoming SMTA International exhibition and conference, scheduled to take place August 19-20, 2008 in Orlando, FL.

Blue Thunder Technologies, Inc.

SHENMAO Technology to Exhibit New Solder Alloy with High Thermal & Impact Reliability at SEMICON Southeast Asia

Industry News | 2018-04-25 20:05:59.0

SHENMAO America, Inc. today announced plans to exhibit in Booth 433 at SEMICON Southeast Asia, scheduled to take place May 22-24, 2018 at the new Malaysia International Trade & Exhibition Centre (MITEC) in Kuala Lumpur. SEMICON SE Asia is the region's premier gathering of the industry for connecting people, products, technologies and solutions across the global electronics manufacturing supply chain. SHENMAO plans to introduce its new PF906-S and PF912-S solder alloys.

Shenmao Technology Inc.

MicroCare Unveils New Flux Remover Packaging at IPC APEX 2018

Industry News | 2018-03-01 19:44:00.0

MicroCare Corp. stunned the PCB cleaning industry with a flurry of innovation at the massive IPC APEX EXPO in San Diego, CA this week with the launch of ten new cleaning products. Featured among these developments are popular flux-cleaning chemistries in a new, super-convenient, pocket-sized cleaning pen package. The new range features three formulations: the No-Clean Flux Remover, the RMA Flux Remover, and the Water-Soluble Flux Remover Pens. These three new cleaners have been designed to specifically remove fluxes quickly and safely and ensure PCBs will enjoy a long and productive life at the lowest possible cost.

MicroCare Corporation

FCT Solder's Range of Solder Wire Products Commended for Positive Performance

Industry News | 2008-11-03 21:35:34.0

GREELEY, CO � October 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.'s SN100C product line, announces positive customer feedback concerning the performance of its NC601, WS101, and solid SN100C solder wires.

FCT ASSEMBLY, INC.

New Low Residue No-Clean Flip Chip Flux SMF-D61 from SHENMAO

Industry News | 2024-02-12 13:43:22.0

SHENMAO Technology is pleased to announce the availability of its latest innovation, the SMF-D61 Low Residue No-Clean Flip Chip Flux. This advanced flux is meticulously engineered to meet the demanding requirements of flip chip dipping applications, offering exceptional performance and reliability throughout the soldering process.

Shenmao Technology Inc.

FCT Assembly to Highlight a Range of Proven Pastes at SMTAI 2010

Industry News | 2010-09-29 01:30:07.0

FCT Assembly to highlight its leading solder pastes and stencil technologies in booth 226 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

FCT ASSEMBLY, INC.

See Aqueous Technologies’ Latest Cleaning Equipment at IPC APEX EXPO 2011

Industry News | 2011-03-11 19:47:14.0

Aqueous Technologies Corp. announces that it will feature its leading cleaning equipment in Booth #641 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Aqueous Technologies Corporation


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