Industry News: solder paste water soluble m705-515a-hn (Page 17 of 23)

SHENMAO Wins Mexico Technology Award for Innovative SMBF-08 Visible No-Clean BGA Flux

Industry News | 2023-10-31 18:58:18.0

SHENMAO America, Inc. is proud to announce that it received a 2023 Mexico Technology Award for its groundbreaking SMBF-08 Visible No-Clean BGA Flux. The award was announced at a ceremony on Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo. This innovative flux has redefined surface mount technology (SMT) assembly and BGA ball mount processes, offering unparalleled visibility and performance.

Shenmao Technology Inc.

Heraeus Electronics provides latest materials portfolio for next-generation power electronics and semiconductor advanced packaging at NEPCON Japan 2023

Industry News | 2023-01-23 18:38:38.0

Heraeus Electronics returns to NEPCON Japan after two years of the pandemic. At the exhibition, which is scheduled to take place January 25-27, 2023, at The Tokyo Big Sight, Heraeus Electronics will bring a wide range of innovative materials to enhance power module and semiconductor device performance.

Heraeus

SHENMAO Embarks on Expansion with a New Factory in Texas to Serve Automotive Applications

Industry News | 2024-01-15 14:05:01.0

SHENMAO Technology announces a strategic expansion initiative with the establishment of a new factory in Texas. The move reflects the company's commitment to meeting the growing demand for its high-quality solder products, particularly in the automotive sector. SHENMAO anticipates that the new facility will significantly enhance its production capacity, catering to the needs of key clients, including major players in the electric vehicle manufacturing sector.

Shenmao Technology Inc.

SHENMAO Holds Celebration for 50 Years of Quality Solder Innovation

Industry News | 2023-11-20 15:25:15.0

SHENMAO Technology is proud to commemorate its 50th anniversary. Founded in 1973, SHENMAO has witnessed the evolution of Taiwan's electronics industry, playing a pivotal role in shaping the landscape of solder materials and setting new industry standards.

Shenmao Technology Inc.

AIM's Karl Seelig to Present During Technical Session on Flux at IPC APEX EXPO 2012

Industry News | 2012-01-26 22:30:21.0

AIM announces that Karl Seelig, Vice President of Technology, will present his VOC-Free Flux Study during a technical session entitled Flux.

AIM Solder

AIM’s Karl Seelig to Present VOC-Free Flux Study at PCB West

Industry News | 2012-09-18 14:01:32.0

AIMwill present a paper titled “VOC-free Flux Study: Not All Weak Organic Acids Are the Same” at the upcoming PCB West Conference & Exhibition

AIM Solder

Field Application Engineer Tony Lentz to Present at SMTAI

Industry News | 2014-08-28 11:13:11.0

FCT Assembly today announced that Field Application Engineer Tony Lentz will present paper titled “Performance Enhancing Nano Coatings: Changing the Rules of Stencil Design” at the upcoming SMTA International exhibition.

FCT ASSEMBLY, INC.

Water Soluble, Tin-Lead Solder Paste from Henkel Enables High-Yield Results for Demanding Applications

Industry News | 2017-02-23 13:23:33.0

Henkel’s market leadership in solder materials development continues with the commercial launch of LOCTITE HF 2W, a tin-lead, water-washable solder paste designed for high-throughput, high-yield production. Halide- and halogen-free and REACH compliant, LOCTITE HF 2W addresses environmental responsibility while delivering outstanding performance for Pb-based soldering.

Henkel Electronic Materials

Indium Corporation Experts to Present at IMAPS International Symposium on Microelectronics

Industry News | 2023-10-09 09:21:57.0

Indium Corporation is proud to count three of its experts amongst the presenters participating in the technical program at the upcoming IMAPS International Symposium on Microelectronics, October 3-5 in San Diego, California, U.S.

Indium Corporation

SHENMAO Debuts High Thermal Impact Reliability No-Clean Solder Paste PF918-P250, Elevating Automotive Electronics Performance

Industry News | 2023-12-18 13:13:45.0

SHENMAO Technology proudly unveils its latest innovation, the PF918-P250 no-clean solder paste, specifically designed to meet the stringent demands of automotive applications. With a focus on enhancing thermal impact reliability, PF918-P250 sets a new standard for performance, delivering superior results for automotive devices and high-power components.

Shenmao Technology Inc.


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