Industry News | 2018-07-02 21:37:24.0
SHENMAO America, Inc. is pleased to announce the appointment of Mr. Don Dennison of PIT Equipment Services to be their manufacturer’s rep covering Southeastern New York, New Jersey and Eastern Pennsylvania.
Industry News | 2021-11-05 07:21:02.0
SHENMAO America, Inc. is pleased to announce that it received a 2021 Mexico Technology Award in the category of Solder Paste for its new PF606-P245X Lead-Free Solder Paste. The award was announced at a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.
Industry News | 2021-03-02 14:45:26.0
SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.
Industry News | 2023-02-27 18:10:50.0
SHENMAO America, Inc. has released its PF735-PQ10-10L Low Melting Point Lead-Free Solder Paste. The paste has been designed specifically for the SMT process and is applicable to the high-speed printing process to increase production capacity.
Industry News | 2023-03-16 14:42:07.0
SHENMAO America, Inc. has released its new Anti-HoP Lead-Free Solder Paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pillow (HoP) issues.
Industry News | 2024-04-29 08:41:00.0
SHENMAO Technology proudly presents its latest innovation, the PF719-P250A solder paste, specifically designed for AI substrate power management modules. This cutting-edge solder paste represents a significant advancement in thermal fatigue reliability and performance.
Industry News | 2018-10-09 14:46:48.0
Kester will be exhibiting (booth #117) at SMTAI 2018, which will take place October 16-17 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2022-03-14 08:20:37.0
SHENMAO America, Inc. is pleased to introduce its PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy, which is designed with high thermal impact reliability for long service life electronic products with high-reliability requirements.
Industry News | 2014-02-27 17:02:28.0
The Balver Zinn Group announces that it will exhibit in Booth #2714 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, NV.
Industry News | 2013-01-15 13:14:32.0
Aqueous Technologies will exhibit in booth #3127 at the upcoming IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California.
