Industry News | 2014-03-07 15:01:40.0
Bajabid.com will be conducting an online SMT Exchange Auction. This event will include a wide variety of electronic manufacturing & assembly equipment from several sellers sites located at different sites around the United States.
Industry News | 2014-03-19 15:09:03.0
BajaBid will be completing its latest online SMT Exchange Auction tomorrow [Thursday 3/20/14]. This event will include a wide variety of electronic manufacturing & assembly equipment from several sellers located at different sites around the United States.
Industry News | 2013-10-02 14:39:35.0
Baja Bid announced its latest event which features quality used equipment at discounted prices for the electronics manufacturing industry.
Industry News | 2022-12-07 07:48:52.0
With synchronous motion, the SELECT Synchro system boosts throughput 20-40% for most applications in a 60% smaller footprint
Industry News | 2012-03-09 17:47:15.0
IPC has issued a Call for Participation for the technical conference at IPC Midwest Conference & Exhibition™. The one show in the Midwest focused on printed boards and electronics manufacturing, this year’s event will take place August 22–23, 2012, at the Renaissance Schaumburg Convention Center in Schaumburg, Ill. Researchers, academics, technical experts and industry leaders are invited to submit abstracts on the materials and processes that contribute to the performance of printed board assemblies.
Industry News | 2020-04-14 22:14:18.0
ITW EAE is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one nozzle.
Industry News | 2015-09-30 10:08:42.0
IPC — Association Connecting Electronics Industries® has released IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards. IPC delivers the most current specifications for rigid printed board requirements to the electronic industry. The newly updated revision D will be release in conjunction with IPC-6012DS, Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards, which addresses requirements for space and military avionics.
Industry News | 2012-08-09 18:42:34.0
IPC has released IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.
Industry News | 2019-04-30 18:05:43.0
Nordson ASYMTEK will exhibit its new conformal coating line and dispensing solutions at SMTconnect, Nuremberg, Germany, with SmartTec GmbH in Stand 4-101 and in the Fraunhofer IZM Future Packaging Line Stand 5-434. In addition, Gerd Schulze, key account manager, Nordson ASYMTEK, will present "Protecting Electronics -- Adhesive and potting options and practical examples" at SMTconnect Technology Days. SMTconnect is being held May 7-9, 2019.
Industry News | 2024-04-08 14:08:57.0
Nordson Electronics Solutions expands the SELECT® Synchro™ selective soldering equipment family with new Synchro 3 release
