Industry News: solder pot temperature selective (Page 4 of 53)

SMTA International 2016 Best Papers Announced

Industry News | 2016-12-20 13:18:31.0

The SMTA is pleased to announce the Best Papers from SMTA International 2016. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. To reward exceptional achievement, $1,000 awards and plaques are given for the Best of Conference Presentation, Best of Proceedings Paper, Best International Paper, as well as a $500 award for Best Student Paper.

Surface Mount Technology Association (SMTA)

Unveiling Innovation: Introducing the SMTA International Technical Program for Advancing Electronics Manufacturing

Industry News | 2023-08-14 12:09:39.0

The SMTA announced that the technical program of their annual conference, SMTA International, is finalized and registration is now open. The event will be held October 9 - 12, 2023 at the Minneapolis Convention Center in Minneapolis, MN, USA.

Surface Mount Technology Association (SMTA)

IPC MIDWEST TECHNICAL CONFERENCE FOCUSES ON WORKING SMARTER TO INCREASE RELIABILITY AND MINIMIZE DEFECTS

Industry News | 2012-05-30 18:23:07.0

IPC Midwest Conference & Exhibition™ will highlight advances in assembly materials, assembly processes and reliability testing to help electronics companies address critical challenges in manufacturing defect-free, quality electronics

Association Connecting Electronics Industries (IPC)

Raspberry Pi Co-Founder to Keynote Advanced Electronics Assembly Conference

Industry News | 2019-10-03 14:15:15.0

SMTA announced Pete Lomas, FREng, Co-Founder and Hardware Designer of Raspberry Pi, will keynote the Advanced Electronics Assembly Conference on November 19, 2019 in Budapest, Hungary, and November 21, 2019 in Oradea, Romania.

Surface Mount Technology Association (SMTA)

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performa

Industry News | 2018-02-19 13:55:53.0

IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.

Association Connecting Electronics Industries (IPC)

Cleaning Up the No-Clean Myth - IPC Releases New Update of Guidelines for Cleaning of Printed Boards & Assemblies

Industry News | 2011-07-26 22:29:00.0

It’s well-known that residues on printed board assemblies can lead to serious reliability problems. To help the process engineering community deal with these difficulties, IPC has released the B revision of IPC-CH-65, Guidelines for Cleaning of Printed Boards & Assemblies.

Association Connecting Electronics Industries (IPC)

Best Technical Papers at IPC APEX EXPO 2022 Selected

Industry News | 2022-01-14 17:06:40.0

Expanded technical conference award categories include NextGen and Student Research

Association Connecting Electronics Industries (IPC)

Innovative Technology Center at IPC APEX EXPO Highlights Leading Edge Technologies.

Industry News | 2010-03-27 19:26:29.0

BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.

Association Connecting Electronics Industries (IPC)

New Tutorial Released With IPC-2223C Provides Expert Advice and Tips for Designers Working With Flexible Circuits

Industry News | 2012-03-28 08:47:23.0

he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.

Association Connecting Electronics Industries (IPC)


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