Industry News | 2022-01-10 16:49:36.0
SHENMAO America, Inc. is pleased to announce plans to exhibit in Booth #2534 during the 2022 IPC APEX EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center in California. The company will highlight its PF918-S High Reliability Solder Sphere and PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste. The new paste is formulated with the new SHENMAO Sn/4Ag/3Bi Alloy design with high thermal impact reliability.
Industry News | 2024-03-18 13:22:09.0
SHENMAO Technology is pleased to announce that its PF735-PQ10-10 Low-Temperature Lead-Free Solder Paste is specifically designed for SMT processes, offering a low melting point to accommodate high-speed printing processes. Designed to meet the evolving needs of the electronics manufacturing industry, PF735-PQ10-10 offers a range of features and benefits to enhance SMT processes and improve production efficiency.
Industry News | 2021-12-17 16:30:28.0
One of the most highly demanded applications for 80Au20Sn is semiconductor laser die-attach due to recent advancements that have made lasers an economical option for a multitude of new products. However, a key challenge with semiconductor lasers is thermal management, as these devices generate a significant amount of heat. Indium Corporation Product Specialist Jenny Gallery will present on how to manage heat with AuSn preforms at SPIE Photonics West, Jan. 22-27, San Francisco, Calif., U.S.
Industry News | 2018-04-25 20:05:59.0
SHENMAO America, Inc. today announced plans to exhibit in Booth 433 at SEMICON Southeast Asia, scheduled to take place May 22-24, 2018 at the new Malaysia International Trade & Exhibition Centre (MITEC) in Kuala Lumpur. SEMICON SE Asia is the region's premier gathering of the industry for connecting people, products, technologies and solutions across the global electronics manufacturing supply chain. SHENMAO plans to introduce its new PF906-S and PF912-S solder alloys.
Industry News | 2020-05-30 12:34:54.0
SHENMAO America, Inc. is pleased to introduce its new PF606-RT35 room temperature solder paste (RTS) that has been specially designed for SMT processes. Compared with common pastes, the no-clean paste provides consistent printing performance, low voiding, stable viscosity life, and excellent testability. With the wide reflow window, it even can be easily fit into the process of the most complicated PCB design.
Industry News | 2023-01-30 16:07:57.0
SHENMAO America, Inc. received a 2023 NPI Award in the category of Soldering Materials for its PF918-PW216 water-soluble high thermal impact reliability solder paste. The award was announced during a ceremony that took place Monday, Jan. 23, 2023 in San Diego.
Industry News | 2024-02-12 13:43:22.0
SHENMAO Technology is pleased to announce the availability of its latest innovation, the SMF-D61 Low Residue No-Clean Flip Chip Flux. This advanced flux is meticulously engineered to meet the demanding requirements of flip chip dipping applications, offering exceptional performance and reliability throughout the soldering process.
Industry News | 2005-02-22 09:45:32.0
Indium Corporation will exhibit at IMAPS MicroTech 2005 on March 1 & 2.
Industry News | 2017-01-30 20:02:15.0
Featuring how to solve Solder Paste issues such as Voids, Head on Pillow, Slumping, Non-Wetting Open and Short Stencil Life with Higher Quality Flux and Extremely Pure Virgin Powder made by SHENMAO, Resulting in Solder Joints of Ultimate Quality.
Industry News | 2017-05-03 13:36:08.0
SHENMAO is featuring how to solve Solder Paste issues such as Voids, Head on Pillow, Slumping, Non-Wetting Open and Short Stencil Life with Higher Quality Flux and Extremely Pure Virgin Powder made by SHENMAO, Resulting in Solder Joints of Ultimate Quality.
