Industry News | 2013-11-25 19:25:17.0
Indium Corporation's Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore.
Industry News | 2016-06-05 13:20:49.0
SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations.
Industry News | 2017-07-06 09:53:39.0
SHENMAO Technology introduces New Generation Ultra Low Residue Liquid Flux SMF-B51 with superior spray uniformity, excellent soldering performance and a wide process window for Chip Scale and Fan Out Wafer Level Packaging.
Industry News | 2016-04-22 14:45:12.0
Indium Corporation has hired Andreas Karch as Regional Technical Manager, Germany, Austria and Switzerland.
Industry News | 2016-03-11 00:09:40.0
Indium Corporation will be running its low-voiding solder products "Live@APEX" in partner booths throughout IPC APEX Expo 2016. "Live@APEX," a joint effort between Indium Corporation and its industry partners, accurately and honestly depicts the performance of the company’s materials in real time. The program places Indium Corporation products into live equipment demonstrations on the APEX show floor.
Industry News | 2023-11-20 15:25:15.0
SHENMAO Technology is proud to commemorate its 50th anniversary. Founded in 1973, SHENMAO has witnessed the evolution of Taiwan's electronics industry, playing a pivotal role in shaping the landscape of solder materials and setting new industry standards.
Industry News | 2004-10-15 16:35:07.0
To meet the high demand of water-soluble solder paste users who need to comply with the Pb-Free requirements, Indium Corporation of America has developed the next generation of Pb-Free Solder Paste, Indium3.1.
Industry News | 2016-05-16 20:59:04.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2016-07-02 06:40:16.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2010-03-17 17:33:03.0
Indium Corporation announces that Jacques Matteau has joined the team as Global Sales Manager, NanoBond® and NanoFoil®. Jacques is based in San Carlos, California, USA.
