Industry News: solder preform (Page 23 of 37)

Reliability the Focus of Indium Corporation at Nepcon East/Electro

Industry News | 2006-04-20 12:26:41.0

Indium Corporation will highlight its Reliability Program at their exhibit at Nepcon East/Electro, May 10-11, 2006 in Boston, MA. Indium�s team of experts will be available at booth #3017 to answer questions and provide information.

Indium Corporation

Indium Corporation�s Dr. Ning-Cheng Lee and Dr. Ronald Lasky to Present at Lead-Free Workshop

Industry News | 2006-09-28 13:40:04.0

Indium Corporation�s Vice President of Technology, Ning-Cheng Lee, Ph.D., and Senior Technologist, Ronald C. Lasky, Ph.D., PE, will present at Implementing Lead-free: A Hands-on Workshop, October 16-19, 2006 at the Rochester Institute of Technology (RIT) Campus in Rochester, NY USA.

Indium Corporation

Indium Corporation’s Dr. Lee to Present at Solder Technology Forum.

Industry News | 2014-08-13 16:00:44.0

Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present at the 2014 China Solder Technology Forum and Exhibitions (CSTF) Aug. 26-27 in Shenzhen, China.

Indium Corporation

Indium Corporation's SACM™ Provides Superior Drop Shock Performance AND Thermal Cycling Reliability

Industry News | 2013-11-01 13:11:17.0

Indium Corporation's new SACM™ is a high-reliability solder alloy that offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling – all at a cost below that of typical SAC solder alloys.

Indium Corporation

Indium Corporation Announces High-Melting Pb-free Solder Alternatives Agreement with Ormet Circuits

Industry News | 2010-04-23 18:53:17.0

Indium Corporation announces the signing of a joint marketing and technical support agreement for high-temperature Pb-free electronics assembly materials patented and manufactured by Ormet Circuits, Inc.

Indium Corporation

Indium8.9HF1-P Delivers High First Pass Yields for In-circuit Testing

Industry News | 2013-12-10 12:14:34.0

Indium Corporation introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indium's unique halogen-free oxidation barrier technology with optimized no-clean residues for enhanced probe testing. Indium8.9HF1-P saves time and money on testing by eliminating false failures and giving the highest first pass yields.

Indium Corporation

Indium Corporation VP of Technology to Present at IUMRS-ICEM 2014

Industry News | 2014-05-28 07:06:54.0

Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will share his expertise at the International Union of Materials Research Societies - International Conference on Electronic Materials (IUMRS-ICEM) from June 10-14 at Taipei World Trade Center Nangang Exhibition Hall in Taipei, Taiwan.

Indium Corporation


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