Industry News: solder preform (Page 4 of 37)

Indium Corporation Technology Experts to Present at PCIM Europe

Industry News | 2014-05-05 11:18:08.0

Indium Corporation technology experts will present at PCIM Europe May 20-22 in Nuremberg, Germany.

Indium Corporation

SHENMAO Introduces New Solder Wire for Automatic Soldering

Industry News | 2020-05-25 13:28:07.0

SHENMAO America, Inc. is pleased to introduce its new PF606-F13 lead-free and halogen-free solder wire designed for automatic soldering equipment. The new solder wire enhances high-precision soldering, soldering efficiency and offers stable soldering quality.

Shenmao Technology Inc.

SHENMAO America Exhibits at IWLPC October 13-14 in San Jose, CA

Industry News | 2015-10-07 11:27:38.0

SHENMAO will exhibit at IWLPC October 13-14 in San Jose, CA, USA – Booth No. 505

Shenmao Technology Inc.

New Low-Temperature Solder Paste from SHENMAO

Industry News | 2018-06-17 16:55:59.0

SHENMAO America, Inc. is pleased to introduce its PQ10 Low Temperature Solder Paste. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.

Shenmao Technology Inc.

SHENMAO to Exhibit New Solder Pastes with NeVo at productronica

Industry News | 2021-10-11 16:08:26.0

SHENMAO America, Inc. today announced plans to exhibit together with NeVo GmbH at productronica 2021, scheduled to take place Nov. 16-19, 2021 at Neue Messe München in Munich, Germany. NeVo will showcase Shenmao's PF918-P250 Thermal Fatigue Resistance Lead-free Solder Paste and PF606-P245X Lead-Free Solder Paste.

Shenmao Technology Inc.

Indium Corporation Wins Global Technology Award for InFORMS®

Industry News | 2015-12-01 11:54:37.0

Indium Corporation was presented with the Global Technology Award for Best Products - Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany.

Indium Corporation

SHENMAO SMF-WC53 Water-Soluble Ball-Attach Flux and Solder Sphere

Industry News | 2019-06-02 18:40:27.0

SHENMAO America, Inc. introduces SMF-WC53 Water Soluble Ball-Attach Flux and Solder Sphere for use in ball-attach processes. With excellent solderability and high reliability, SHENMAO’s solder sphere can be used in a wide range of solder applications with various sizes from 50-760 μm.

Shenmao Technology Inc.

SHENMAO Offers Industry-Leading UV Visible Lead-Free No-Clean Solder Paste PF629-P214UV

Industry News | 2023-04-24 19:16:05.0

SHENMAO America, Inc. is proud to announce the release of its new product, the UV Visible Lead-Free No-Clean Solder Paste PF629-P214UV. This innovative new solder paste is designed to meet the demands of modern electronics manufacturing, offering excellent performance and reliability.

Shenmao Technology Inc.

SHENMAO Introduces New Generation Lead-Free Solder Paste PF606-P140 To Solve HoP Issues and Improve ICT Testability at SMTAI Exhibition

Industry News | 2017-09-12 20:15:18.0

SHENMAO Technology introduces New Generation Lead-free Solder Paste PF606-P140. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues and can easily fit into highly complicated PCB designs through excellent convergence performance.

Shenmao Technology Inc.

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability

Industry News | 2017-11-28 09:32:15.0

SHENMAO Technology introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues, produces the lowest void and easily fit complicated PCB designs through excellent convergence performance.

Shenmao Technology Inc.


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