Industry News: solder temp (Page 2 of 9)

Nihon Superior to Introduce TempSave duringAPEX 2021

Industry News | 2021-02-12 16:08:40.0

Nihon Superior Co. Ltd is pleased to announce thatit will exhibit its newly developed TempSave series during the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. The company also will showcase its NozzleSave alloyalong with SN100CV P608 and LF-C2 P608 solder pastes.

Seika Machinery, Inc.

FINETECH to Demonstrate Compact Rework System at SMTAI 2009

Industry News | 2009-09-18 10:24:30.0

Tempe, AZ - FINETECH will exhibit the FINEPLACER® CRS 10 rework system in booth 322 at the upcoming SMTA International, scheduled for October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego, CA. The system will demostrate rework of 0201 passives, BGA‘s, and QFN devices, as well as residual solder removal.

Finetech

Nihon Superior to Highlight SN100CV P608 Paste at SMTAI

Industry News | 2023-09-11 17:19:08.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its SN100CV P608 solder paste in Booth #1415 at the SMTA International Exposition, scheduled to take place Oct. 10-11, 2023 at the Minneapolis Convention Center in Minneapolis, MN.

Nihon Superior Co., Ltd.

MARTIN to Demonstrate Stand Alone QFN Solder Bumping and BGA Reball Unit at the SMTA Arizona-Sonora Expo & Tech Forum

Industry News | 2010-11-18 11:04:08.0

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Arizona-Sonora Expo & Tech Forum, scheduled to take place Wednesday, December 1, 2010 at the Fiesta Inn Resort & Conference Center in Tempe, AZ.

Finetech

Koh Young discussing the Progress Toward a Smart Factory as part of a Webinar Series on May 12, 2020

Industry News | 2020-05-04 14:31:56.0

Koh Young America is sharing its insights about the Smart Factory in an online seminar scheduled at 10:45am EST on 12 May 2020 in a panel focused on the progress electronics manufacturers have made to implement a smart factory.

Koh Young America, Inc.

Nordson EFD Introduces Unity HiTemp Disposable Syringe Barrels that Withstand up to 180° C for Eight Hours

Industry News | 2015-12-02 17:52:02.0

Nordson EFD introduces Unity™ HiTemp™ syringe barrels. These disposable 30cc barrels reduce the downtime and maintenance costs often associated with aluminum barrels commonly used in the pneumatic dispensing of hot melt adhesives.

Nordson EFD

SHENMAO Showcasing Liquid Flux and Low Temp Solder at SMTA Guadalajara

Industry News | 2019-10-08 06:12:57.0

SHENMAO America, Inc. is pleased to announce plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 23-24, 2019 at the Expo Guadalajara. The company will show its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux in Booth #602.

Shenmao Technology Inc.

Advanced Liquid Flux and Low Temp Solder from SHENMAO at SMTA Silicon Valley Expo

Industry News | 2019-11-25 11:02:32.0

SHENMAO America, Inc. announces that it will exhibit at the SMTA Silicon Valley Expo, scheduled to take place Wednesday, Dec. 4, 2019 at the Bestronics Box Build Facility in San Jose, CA. The company will showcase its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux.

Shenmao Technology Inc.

How To Set Profile In SMT Reflow Oven

Industry News | 2018-10-18 09:37:27.0

How To Set Profile In SMT Reflow Oven

Flason Electronic Co.,limited

FINETECH to Demonstrate Compact Rework System at IPC Midwest 2008

Industry News | 2008-09-16 12:35:27.0

Tempe, AZ - FINETECH will exhibit the FINEPLACER� CRS 10 Compact Rework System in booth #809 at IPC Midwest 2008, scheduled for September 24-25, 2008 in Schaumburg, IL.

Finetech


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