Industry News | 2011-09-12 13:16:36.0
FINETECH will showcase the FINEPLACER® Lambda in Booth #306 at the upcoming IMAPS 44th International Symposium on Microelectronics exhibition
Industry News | 2012-09-05 08:13:47.0
Finetech will showcase the FINEPLACER® Lambda in Booth #505 at the upcoming IMAPS 45th International Symposium on Microelectronics exhibition
Industry News | 2009-08-20 15:16:57.0
August 2009 — Cobar Solder Products, part of the Balver Zinn Group, announces that MicroTech Manufacturing, a contract manufacturer in the Phoenix area, now is using Cobar SN100C-XF3 as the standard lead-free solder paste for all its customers unless specifically directed to use a different material.
Industry News | 2010-10-06 11:52:25.0
FINETECH/MARTIN announces that it will host the upcoming SMTA Boston Chapter meeting on Tuesday, October 12, 2010 at its facility in Manchester, NH. Joe Belmonte, Principal Consultant at ITM Consulting, will present "Considerations in Miniature SMT Component Assembly."
Industry News | 2019-11-13 11:25:07.0
Thermaltronics USA, Inc. announces that it was awarded a 2019 Global Technology Award in the category of Soldering Robots for its TMT-R9900S Inline Robot Soldering System. The award was presented to the company during a Tuesday, Nov. 12, 2019 ceremony that took place during productronica in Munich, Germany.
Industry News | 2011-08-29 17:01:41.0
Kyzen announces that Dr. Mike Bixenman will present “Design for Cleaning Medical Electronic Circuit Devices” at the 2011 Medical Electronics Symposium presented by MEPTEC and SMTA.
Industry News | 2007-11-27 12:13:09.0
FINEPLACER� Micro MA is a bonding platform characterized by an enlarged working space (max. substrate size 460 mm x 310 mm) combined with placement accuracy better than 10 micron. The system is suitable for small component assembly with a pitch down to 50 micron.
Industry News | 2008-04-07 21:09:26.0
FINETECH announces that it will display the FINEPLACER� Lambda system at the upcoming NEPCON China 2008 trade show and exhibition, scheduled to take place April 8 to 11, 2008, in Shanghai, China. This high precision bonder provides a placement accuracy of � 0.5 micron.
Industry News | 2009-09-17 14:39:48.0
FINETECH’s Neil O’Brien will present “Fine-Pitch QFN Rework — Triple the Challenge in a Lead-Free World” at the upcoming SMTA International at The Town and Country Resort and Convention Center in San Diego. The presentation will be held during session SMT4, titled “Challenges and Solutions Relating to the Rework of QFN Packages,” on Wednesday, October 7, 2009 from 8-9:30 a.m.
Industry News | 2012-01-24 17:11:07.0
Finetech will highlight the FINEPLACER® core rework system in Booth #3020 at the upcoming IPC APEX Expo,.
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