Industry News | 2015-09-30 10:08:42.0
IPC — Association Connecting Electronics Industries® has released IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards. IPC delivers the most current specifications for rigid printed board requirements to the electronic industry. The newly updated revision D will be release in conjunction with IPC-6012DS, Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards, which addresses requirements for space and military avionics.
Industry News | 2015-03-16 06:51:04.0
Void Formation in Solder Joints – Causes & Cures Webinar Monday 18th May 2.30pm GMT Voiding in solder joints is not new we have experienced cavities in solder joints during the introduction of through hole, surface mount and more recently area array technology. In many cases we never knew we have had voids till the introduction of x-ray inspection.
Industry News | 2017-10-17 20:32:02.0
Inventec presents a new ultra low voiding formula, Ecorel Free 305-16LVD to achieve optimal voiding performance in automotive, power electronics, LED lighting and other high reliability applications, without degradation of high speed printability and chemical reliability. Solder voiding is a complex phenomenon under the combination of many interactions affecting both the reliability and quality of solder joints, in such interactions solder paste is a key contributor.
Industry News | 2018-09-18 20:11:02.0
Nihon Superior Co.today announced plans to exhibit in Booth #511 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will showcase the new SN100CVTM P608 D4 solder paste, NS-F851 rosin-based flux, ALUSAC-35 alloy and Alconano Nano-Silver paste.
Industry News | 2019-08-17 11:50:22.0
OSAKA, JAPAN — August 2019 — Nihon Superior Co. Ltd., an advanced joining material supplier, today announced plans to exhibit in Booth #1G08 at the NEPCON ASIA (NEPCON SOUTH CHINA) Show, scheduled to take place Aug, 28-30, 2019 at the Shenzhen Convention & Exhibition Center in China. The company will celebrate the achievements produced by the well-known SN100C® lead-free alloy. TipSave N flux-cored solder wire will be introduced and SN100CVTM P608 D4 solder paste will be shown.
Industry News | 2019-06-16 10:14:10.0
Bob Willis Defect of the Month explains solder joint voids and are they an issue to everyone? Bobs webinar guide to voids in solder joints and how to overcome them in manufacture is available online and covers all of the different voids and solutions from his archives see https://www.bobwillis.co.uk/product/online-webinar-archive-booking/
Industry News | 2016-02-06 01:03:23.0
Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo.
Industry News | 2016-03-17 14:15:35.0
Manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs. Indium Corporation will help customers Avoid the Void™ with its void-reducing no-clean solder pastes at IPC APEX Expo.
Industry News | 2016-10-04 16:22:38.0
SMART Group announces that it will host a workshop called “Soldering Voids: Formation, Causes and Mitigation” on Tuesday 25th October 2016 at the Manufacturing Technology Centre (MTC) in Ansty Park near Coventry.
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