Industry News | 2016-03-10 18:40:47.0
SHENMAO proudly announces a series of Lead-free LED Die Bonding Solder Pastes made locally in the USA and with the same quality in 8 other worldwide locations for various Die Bonding processes. Powder Size is available from T3 to T8.
Industry News | 2009-04-19 23:40:32.0
Recently launched at the Apex exhibition in Las Vegas, Ovation Products' brand new and award-winning Stinger� adhesive dispenser is currently attracting attention industry-wide. Offering unmatched equipment utilization, Stinger enables dual function capability from a single screen printer.
Industry News | 2024-06-10 10:12:04.0
We invite you to SMTconnect, Booth 4.209, from June 11 - 13 in Nuremberg, Germany. Discover Essemtec's solutions with all-in-one combined dispensing & pick-and-place processes and integrated inspection systems.
Industry News | 2016-09-01 19:14:20.0
Fancort Industries, Inc. announces that it now offers new robotic soldering & flux ‘kits’ that allow integrated soldering and flux dispense on a single robot.
Industry News | 2016-03-24 21:18:44.0
Techcon Systems will exhibit in Booth #B-1E52 at NEPCON China, scheduled to take place April 26-28, 2016 at the Shanghai World EXPO Exhibition & Convention Center. Company representatives will debut the new TS9300HM Hot Melt Jet Valve at the show and showcase its lineup of industry-leading valves.
Industry News | 2016-02-25 14:29:00.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2016-05-31 20:58:06.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2018-10-18 11:19:07.0
How To Design Cost-Effective PCBs
Industry News | 2022-03-22 16:06:45.0
XJTAG®, a leader in JTAG boundary scan products, announces a new software release that speeds up the development and debugging of boundary scan setups, and also helps to stop production line operators being distracted by too much information when they run tests.
Industry News | 2019-03-31 21:26:01.0
PVA will exhibit at the ElectronTechExpo, scheduled to take place April 15-17, 2019 in Moscow, Russia. The company will showcase the Delta 6 conformal coating/dispensing system known for the ability to dispense the Belhim material UR231 as well as the ST100S and CAM200 manual conformal coating systems in Pavilion 3, Hall 13, Stand B535.
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