Industry News | 2015-09-16 10:43:38.0
Inovar announces that it recently purchased and installed four MS-11 solder paste inspection (SPI) systems from MIRTEC.
Industry News | 2014-07-28 15:50:58.0
Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.
Industry News | 2018-04-09 10:49:39.0
(Albany, NY)– Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.
Industry News | 2013-04-26 13:53:25.0
The Balver Zinn Group announces that Cobar Solder Products Inc. has introduced its new 95 RX Flux Series.
Industry News | 2014-10-13 16:48:28.0
With production volumes of mobile phones and tablet PCs growing, and indeed the predicted growth of 'wearables', the need to decrease development cycles and improve capacity is ever more important. SolderStar Ltd has developed new technology to help in the production of this growing trend.
Industry News | 2012-01-26 22:47:26.0
SEHO Systems GmbH announces that Christian Ott will present a paper titled “Reduction of Voids in Solder Joints: An Alternative to Vacuum Soldering” during the Voiding 1: Process and Test Technical Session on Tuesday, February 28, 2012 from 1:30-3 p.m. at the San Diego Convention Center in San Diego, CA. The paper, authored by Rolf Diehm, Mathias Nowottnick and Uwe Pape, will discuss voids in solder joins as one of the main problems for power electronics.
Industry News | 2017-04-13 06:06:32.0
Solderability Benchmarking, Failures & Testing Methods 14th August All our webinars are based on 2.30pm UK time go to https://www.bobwillis.co.uk/events/ Benchmarking you PCB surface finish or the impact of baking boards or components can be simple in production and the laboratoy. Long term solderability of component terminations and printed circuit boards is fundamental in modern assembly processes. This is all practical experience not just theory for the presenters countless studies in industry
Industry News | 2017-09-12 10:05:15.0
Do you have XRAY model HP/Agilent 5DX? Are you aware that the analysis of soldering quality from XRAY data (despite limits and distribution) can improve product quality? Can you easily and quickly perform SPC calculations on XRAY data for different aspects, attributes, productions and more?
Industry News | 2014-09-15 11:23:08.0
With production volumes of mobile phones and tablet PCs growing, and indeed the predicted growth of ‘wearables’, the need to decrease development cycles and improve capacity is ever more important. SolderStar Ltd, a leading specialist manufacturer in the design and development of thermal profiling equipment for the lead-free electronics industry, has developed new technology to help in the production of this growing trend.
Industry News | 2014-09-15 11:54:22.0
With production volumes of mobile phones and tablet PCs growing, and indeed the predicted growth of ‘wearables’, the need to decrease development cycles and improve capacity is ever more important. SolderStar Ltd, a leading specialist manufacturer in the design and development of thermal profiling equipment for the lead-free electronics industry, has developed new technology to help in the production of this growing trend.
