Industry News | 2009-02-03 13:34:04.0
New PCB Rework, Repair, Fabrication Training & Consulting Services.
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2010-05-07 16:01:14.0
New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.
Industry News | 2011-02-14 14:35:18.0
Christopher Associates/Koki Solder announces that Jasbir Bath, Consulting Engineer, will give a presentation about Head-in-Pillow Component Soldering Defects at the upcoming LA/O.C. SMTA Chapter Dinner, scheduled to take place Thursday, February 17, 2011 at JT Schmid’s Restaurant & Brewery in Anaheim, CA at 7 p.m.
Industry News | 2014-08-28 12:11:35.0
Vi TECHNOLOGY announces that it will exhibit in Booth #319 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2018-04-09 10:49:39.0
(Albany, NY)– Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.
Industry News | 2014-07-28 15:50:58.0
Miniaturization is a trend in the electronic industry, which has increasingly attracted more attention. However, the manufacturing process and reliability have become more and more challenging due to miniaturization. The main issues that miniaturization present are the strength of solder joints, decreasing thermal cycling performance, and product reworkability.
Industry News | 2017-08-30 16:58:11.0
Akrometrix will be a panelist in the upcoming SMTAI Spotlight 5 panel discussion, scheduled to take place Wednesday, Sept. 10, 2017 from 2-3 p.m. The discussion, entitled “Warpage Induced Defects and Component Warpage Limits,” will be streamed on Facebook Live.
Industry News | 2011-06-16 14:28:11.0
STI Electronics announces that Mark McMeen, Vice President of Manufacturing and Engineering Services, will present “Flex Circuit Assembly Issues: What the Fabricator needs to Know” at the upcoming IPC FLEX CONFERENCE, scheduled to take place June 21-23, 2011.
Industry News | 2007-10-29 17:10:53.0
Aesch/Switzerland � Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it will highlight the CDS6700 dispenser with the new piezo flow valve for solder paste dispensing in booth A5-277 and A5-278 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.
