Industry News: soldering to nickle plating (Page 4 of 10)

SHENMAO to Debut New Pastes & Fluxes at electronica China

Industry News | 2019-03-05 17:59:34.0

SHENMAO America, Inc. is pleased to announce that it will exhibit at electronica China, scheduled to take place March 20-22, 2019 at the Shanghai New International Expo Centre. The company will showcase its PQ10 series low temperature solder paste, new P250 series solder paste for automobile electronics, PW215 water soluble solder paste, SMF-WC53 water soluble ball-attach flux and solder sphere, and water-based wave soldering flux & water-based cleaner.

Shenmao Technology Inc.

SHENMAO to Present at the 31st Annual Electronics Packaging Symposium

Industry News | 2019-08-12 20:00:01.0

SHENMAO America is pleased to announce that it will exhibit at the 31st Annual Electronics Packaging Symposium- Small Systems Integration, scheduled to take place Sept. 5-6, 2019 in Binghamton, NY. Watson Tseng, General Manager, SHENMAO America, will present “New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly.”

Shenmao Technology Inc.

Thermaltronics to Exhibit with Distributor (Adopt SMT) at SMT/Hybrid/Packaging 2018

Industry News | 2018-05-08 19:17:52.0

Thermaltronics have appointed Adopt SMT as the exclusive distributor of the new Thermaltronics Soldering Robot in Germany. They will exhibit the new Thermaltronics robot, TMT-R9800S, in Hall 4A, Booth 458 and 460, at the upcoming SMT/Hybrid/Packaging show scheduled to take place June 5-7, 2018 at the Messe in Nuremberg, Germany.

Thermaltronics USA, Inc.

Nihon Superior to Exhibit TipSave N at APEX 2020

Industry News | 2020-01-06 16:02:00.0

Nihon Superior Co. Ltd. is pleased to announce plans to showcase its new TipSave N flux-cored solder wire in Booth #2043 at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. The company also will exhibit SN100CV P608 D5 solder paste.

Nihon Superior Co., Ltd.

Microtronic GmbH Partners with Loadpoint to Offer Dicing Service

Industry News | 2013-11-18 16:42:52.0

Microtronic GmbH has entered into a strategic partnership with Loadpoint to offer a dicing and grinding service.

Microtronic GmbH

FCT Assembly Installs New Micrometers to Improve Stencil Accuracy

Industry News | 2013-05-13 15:09:59.0

FCT Assembly today announced that it has installed new Mitutoyo Deep Throat Micrometers to accurately measure the step etch depth over the entire surface of the stencil.

FCT ASSEMBLY, INC.

SMART Group to Host Informational Events

Industry News | 2011-12-19 17:19:52.0

SMART Group, Europe’s largest technical trade association focusing on surface mount and related technologies, announces key events to further the industry’s knowledge base.

The SMART Group

SHENMAO to Debut New Solder Wire for Automatic Soldering Equipment at APEX

Industry News | 2019-01-05 16:26:04.0

SHENMAO America is pleased to announce that it will exhibit in Booth #1304 at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will showcase its new PF606-F13 solder wire and PQ10 series low temperature solder paste.

Shenmao Technology Inc.

Scienscope to Display X-SPECTION 6000 at SMT/Hybrid/Packaging

Industry News | 2016-03-30 08:56:32.0

Scienscope International announces they will exhibit in booth # 7-109 (smartTec GmbH) at the upcoming SMT/Hybrid/Packaging show, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany. On display in the booth will be the X-SPECTION 6000 Cabinet X-Ray Inspection System-the ultimate in flexibility.

SCIENSCOPE International

SHENMAO Introduces New Generation Zero Halogen Lead-Free Solder Paste PF606-P245 to solve HoP issues and Improve ICT Testability

Industry News | 2017-11-28 09:32:15.0

SHENMAO Technology introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability producing great Solder Paste Print Quality and a wide reflow process window for excellent solderability, it prevents Head on Pillow issues, produces the lowest void and easily fit complicated PCB designs through excellent convergence performance.

Shenmao Technology Inc.


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