Industry News: soldering to nickle plating (Page 7 of 10)

Averatek to Present "Reliability of Solder Joints on Flexible Aluminum PC Boards" at SMTAI

Industry News | 2021-10-07 15:38:24.0

Averatek is pleased to announce that it will present a paper during the during the SMTA International Conference Nov. 1-4, 2021 at the Minneapolis Convention Center. Divyakant Kadiwala, Nazarali Merchant, Ph.D., and Benny Lam co-authored "Reliability of Solder Joints on Flexible Aluminum PC Boards."

Averatek Corporation

ECT’s CPG to showcase the ZIP® family at SEMICON WEST

Industry News | 2011-06-13 17:22:02.0

Everett Charles Technologies’ (ECT) Contact Products Group (CPG) will showcase the latest additions to its ZIP® family of flat technology Pogo® pins in Booth #5670 in the North Hall at the upcoming SEMICON West, scheduled to take place July 12-14, 2011 at the Moscone Center in San Francisco. A new eight-page ZIP® Product Portfolio brochure also will be available at the ECT CPG booth.

Everett Charles Technologies

LPKF to Exhibit In-House Prototyping at PCB Carolina 2011

Industry News | 2011-11-03 21:02:04.0

LPKF will highlight the ProtoMat S-Series, E33 and ProtoLaser S in Stand #23 at the upcoming PCB Carolina Expo.

LPKF Laser & Electronics

Indium Corporation Advisor to Present, Host Tutorial at TestConX 2024

Industry News | 2024-02-26 14:01:19.0

Indium Corporation advisor, and founder/principal of DS&A LLC, Dave Saums will present on innovative thermal materials for semiconductor testing at TestConX 2024, held in Mesa, AZ, March 3-6. Saums will open the conference with a tutorial on March 3 and deliver a technical presentation on the topic on March 5.

Indium Corporation

Practical Components to Exhibit Advanced Technologies at IPC APEX 2020

Industry News | 2020-01-07 11:42:27.0

Practical Components announces that it will showcase its advanced technologies at the IPC APEX exhibition in booth 1600 scheduled to take place February 4-6, 2020 at the San Diego Convention Center in San Diego California.

Practical Components, Inc.

Juki to Debut FlexSolder S3532 Stamp Solder System at APEX 2009

Industry News | 2009-03-18 14:01:06.0

MORRISVILLE, NC - March 2009 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it will premiere the FlexSolder S3532 in booth 759 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.

Juki Automation Systems

Indium Corporation to Present, Exhibit at PCIM Asia

Industry News | 2023-08-07 10:18:06.0

Indium Corporation is set to deliver a technical presentation and exhibit its industry-leading products for power electronics assembly at PCIM Asia, August 29-31, in Shanghai, China.

Indium Corporation

Dow Electronic Materials to Showcase Leading Materials for Printed Circuit Board Manufacturing at the IPC APEX EXPO

Industry News | 2011-04-06 13:13:52.0

Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.

Dow Electronic Materials

SMART Group Hosts Successful “Back to Basics” Rework & Inspection Workshop

Industry News | 2013-04-03 18:52:22.0

SMART Group,announces that on 26th March 2013, more than 30 delegates from manufacturing and service repair sectors, including line managers, process and quality engineers, attended its successful “Back to Basics” Hands-on Rework and Inspection Workshop at the Manufacturing Technology Centre in Coventry, UK

The SMART Group

CyberOptics to Showcase Metrology and Inspection Solutions at SEMICON China

Industry News | 2021-03-12 04:57:42.0

CyberOptics® Corporation (NASDAQ: CYBE) will feature the WX3000™ metrology and inspection system with Multi-Reflection Suppression™ (MRS™) sensor technologyat SEMICON China,scheduled to take place March 17-19, 2021 at the Shanghai New International Expo Centre, hall N1, booth 1387 and 1325. The company also will demonstrate high-precision WaferSense® sensors for semiconductor tool setup and diagnostics.

CyberOptics Corporation


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