Industry News | 2020-10-03 08:34:38.0
MIRTEC is pleased to announce that Energy Conversion Applications (ECA), Inc., a full-service EMS provider specializing a full range of turnkey and hybrid solutions for PCB assembly including custom cables & harness, coil winding and complete box build assembly, has selected MIRTEC as their AOI partner with the purchase of an MV-3L Desktop AOI Machine.
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2019-05-20 18:57:09.0
SMTA recently released the Guide to BGA Assembly & Soldering Defects, a complimentary resource for the electronics manufacturing industry. The book was written by Keith Bryant, industry veteran and Chairman of the SMTA Europe Chapter, and reviewed by members of the SMTA Europe Technical Committee.
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2016-02-16 11:59:42.0
Count On Tools will exhibit in Booth #2801 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Company representatives will celebrate COT’s 25-year anniversary with several promotions and giveaways. Additionally, the IPC APEX EXPO will mark the official launch of the QWIKTRAY program for the U.S. market.
Industry News | 2023-10-23 09:52:43.0
TopLine's CCGA Column Grid Array IC packages and large Ball Grid Array (BGA) package solutions will highlight the company's exhibit at Productronica 2023. TopLine will exhibit in Hall A4.460, and the solutions offered by TopLine will include Bonding Wire, CCGA solder columns, IC Chip Trays, Daisy Chain Dummy Components, and PCB Jumpers.
Industry News | 2010-05-11 15:23:38.0
To help electronics manufacturers be more productive and successful, the high complexity of the various steps in the SMT process chain requires that all participants develop innovative solutions jointly and as early as possible so that workflows can be simplified and improved.
Industry News | 2008-01-28 23:33:58.0
Agilent Technologies Inc. (NYSE: A) today unveiled the industry's first DDR2 and DDR3 ball-grid array (BGA) probes for oscilloscopes and logic analyzers. The probes will be shown for the first time at DesignCon, here in Santa Clara, Feb. 4-6, 2008, Booth 305.
Industry News | 2004-02-04 16:52:03.0
Prepare for the 2006 European Deadline
Industry News | 2023-10-31 18:58:18.0
SHENMAO America, Inc. is proud to announce that it received a 2023 Mexico Technology Award for its groundbreaking SMBF-08 Visible No-Clean BGA Flux. The award was announced at a ceremony on Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo. This innovative flux has redefined surface mount technology (SMT) assembly and BGA ball mount processes, offering unparalleled visibility and performance.
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