Industry News | 2014-03-12 11:24:53.0
HITACHI's Sigma G5S modular mounter's Multi-function head now features lead clinching and tamping functionalities. Its lead clinching capability uses side-mounted lighting and machine vision to identify and precisely locate through-hole component leads. During placement/insertion, clinching simultaneously takes place to prevent the inserted component from falling out or becoming dislodged prior to soldering.
Industry News | 2014-04-15 16:32:31.0
Parallel Link Robot made its first North American appearance in the Panasonic Factory Solutions Company booth at the 2014 IPC APEX show with a resounding level of interest.
Industry News | 2014-06-25 14:07:16.0
Koh Young Technology and Koh Young America will effectively enter the Semiconductor market with the unveiling of HORUS, Koh Young's exciting new high-powered 3D measurement system, at SEMICON West in San Francisco.
Industry News | 2014-02-20 19:43:43.0
Scienscope International will showcase their X-Scope X-Ray Inspection Systems at this year's IPC APEX Expo. Live demonstrations of their X-Scope 1800, X-Scope 2000 and X-Scope 6000 machines will be held in booth #2335.
Industry News | 2014-04-08 12:41:23.0
Pickering Interfaces will be showcasing its latest switchingmodules and chassis at SMT Hybrid Packaging 2014 on May 6-8, 2014 in booth 6-321. These products include Pickering’s PXI, RF Matrix, Microwave Multiplexer and LXI ranges.
Industry News | 2014-05-05 16:11:26.0
NEPCON China, the Asian electronics manufacturing industry’s most essential event, launched in Shanghai at the World EXPO Exhibition & Convention Center successfully.
Industry News | 2014-08-28 15:48:58.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Dr. Evstatin Krastev, Director of Applications, will present two papers at the upcoming SMTA International exhibition.
Industry News | 2014-03-06 10:49:59.0
The first meeting of the NEPCON 2014 Advisory Panel was recently held at the offices of the exhibition organizers, Reed Exhibitions Shanghai.
Industry News | 2013-02-06 11:54:13.0
JUKI Corporation (“JUKI”) and Sony Corporation (“Sony”) today announced that they have signed a legally non-binding memorandum of intent to carry on the discussion regarding the possible integration of the surface-mount technology (“SMT”) equipment and related businesses of JUKI and Sony EMCS Corporation, a wholly owned subsidiary of Sony (“Sony EMCS”), under a newly established company (“New Company”).
Industry News | 2013-02-13 22:10:51.0
JUKI Corporation ("JUKI") and Sony Corporation ("Sony") today announced that they have signed a legally non-binding memorandum of intent to carry on the discussion regarding the possible integration of the surface-mount technology ("SMT") equipment and related businesses of JUKI and Sony EMCS Corporation, a wholly owned subsidiary of Sony ("Sony EMCS"), under a newly established company ("New Company").
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